Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
出版年份 2023 全文链接
标题
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy
作者
关键词
-
出版物
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 34, Issue 7, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2023-02-22
DOI
10.1007/s10854-023-09967-7
参考文献
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