Experimental Investigation on the Effect of Ag Addition on Ternary Lead Free Solder Alloy –Sn–0.5Cu–3Bi

The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling

(2016) Ying Zhong et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder

(2016) M.I.I. Ramli et al.   MICROELECTRONICS RELIABILITY

Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly

(2015) A.A. El-Daly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

(2015) Olivér Krammer et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder

(2015) Asit Kumar Gain et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products

(2015) A.A. El-Daly et al.   MATERIALS & DESIGN

The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn–1Ag–0.5Cu solder alloy

(2015) M.H. Mahdavifard et al.   MICROELECTRONICS RELIABILITY

New Sn–0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca

(2014) Jahyun Koo et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Structure and properties of lead-free solders bearing micro and nano particles

(2014) Liang Zhang et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Microstructure evolution and mechanical properties of Sn0.7Cu0.7Bi lead-free solders produced by directional solidification

(2013) Xiaowu Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Ti addition to Sn–Ag and Sn–Cu solders

(2012) W.M. Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Mechanical properties of Sn–0.7Cu/Si3N4 lead-free composite solder

(2012) M.A.A. Mohd Salleh et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

(2011) J. C. Leong et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

(2011) S.Y. Chang et al.   MATERIALS & DESIGN

High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

(2010) Da Yu et al.   MICROELECTRONICS RELIABILITY

Effect of nano Ni additions on the structure and properties of Sn–9Zn and Sn–Zn–3Bi solders in Au/Ni/Cu ball grid array packages

(2009) Asit Kumar Gain et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials