Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

Published 2009 View Full Article

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Title
Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 487, Issue 1-2, Pages 682-686
Publisher
Elsevier BV
Online
2009-08-19
DOI
10.1016/j.jallcom.2009.08.035

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