Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

标题
Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere
作者
关键词
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出版物
JOURNAL OF MATERIALS SCIENCE
Volume 55, Issue 7, Pages 3107-3117
出版商
Springer Science and Business Media LLC
发表日期
2019-10-31
DOI
10.1007/s10853-019-04153-9

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