Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

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Title
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Authors
Keywords
Assembly manufacturing, Flux spattering, In-circuit test, Reliability, Scanning electron microscopy, Soldering
Journal
MICROELECTRONICS RELIABILITY
Volume 56, Issue -, Pages 162-169
Publisher
Elsevier BV
Online
2015-10-26
DOI
10.1016/j.microrel.2015.10.020

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