A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates

Title
A Comparative Study of Reactive Wetting of Lead and Lead-Free Solders on Cu and (Cu6Sn5/Cu3Sn)/Cu Substrates
Authors
Keywords
-
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 37, Issue 10, Pages 1640-1647
Publisher
Springer Nature
Online
2008-06-27
DOI
10.1007/s11664-008-0502-8

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