An observation and explanation of interior cracking at the interface of solder by electromigration

Published 2019 View Full Article

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Title
An observation and explanation of interior cracking at the interface of solder by electromigration
Authors
Keywords
Electromigration (EM), Interfacial crack, Solder, Reliability
Journal
MICROELECTRONICS RELIABILITY
Volume 97, Issue -, Pages 79-84
Publisher
Elsevier BV
Online
2019-05-03
DOI
10.1016/j.microrel.2019.04.013

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