Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current

The reliability of copper pillar under the coupling of thermal cycling and electric current stressing

(2016) Hui-Cai Ma et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

(2015) M.L. Huang et al.   ACTA MATERIALIA

The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling

(2013) Limin Ma et al.   JOURNAL OF APPLIED PHYSICS

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms

(2013) Jussi Hokka et al.   JOURNAL OF ELECTRONIC MATERIALS

The coupling effects of thermal cycling and high current density on Sn58Bi solder joints

(2012) Yong Zuo et al.   JOURNAL OF MATERIALS SCIENCE

Reliability behavior of lead-free solder joints in electronic components

(2012) Liang Zhang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products

(2011) Dhafer Abdulameer Shnawah et al.   MICROELECTRONICS RELIABILITY

Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints

(2010) Chih Chen et al.   Annual Review of Materials Research

The Role of Recrystallization in the Failure of SnAgCu Solder Interconnections Under Thermomechanical Loading

(2010) Toni Tuomas Mattila et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Enhanced stress relaxation of Sn–3.8Ag–0.7Cu solder by electrical current

(2010) Haiyan Liu et al.   JOURNAL OF MATERIALS RESEARCH

Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current

(2010) H.Y. Liu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

The time-dependent melting failure in flip chip lead-free solder interconnects under current stressing

(2008) D. Yang et al.   APPLIED PHYSICS LETTERS

Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints

(2008) Hsiao-Yun Chen et al.   APPLIED PHYSICS LETTERS

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

(2008) Yi-Shao Lai et al.   JOURNAL OF ELECTRONIC MATERIALS