The effect of reduction atmospheres on the sintering behaviors of inkjet-printed Cu interconnectors

Title
The effect of reduction atmospheres on the sintering behaviors of inkjet-printed Cu interconnectors
Authors
Keywords
-
Journal
JOURNAL OF APPLIED PHYSICS
Volume 108, Issue 10, Pages 102807
Publisher
AIP Publishing
Online
2010-11-25
DOI
10.1063/1.3511688

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