Article
Chemistry, Analytical
Pengjie Zheng, Dewen Zhao, Xinchun Lu
Summary: As feature sizes decrease, the investigation of pad unevenness caused by pad conditioning and its influence on chemical mechanical polishing becomes necessary. A kinematic model is set up to predict pad wear profile caused by diamond disk conditioning and verified through experiments. Based on the obtained pad wear profile, a static model is established to investigate the influence of pad unevenness on pad-wafer contact stress.
Article
Engineering, Mechanical
Lin Wang, Ping Zhou, Ying Yan, Dongming Guo
Summary: The micro-scale contact status between the pad and the workpiece surface is crucial in determining the material removal rate during the CMP process. This paper introduces the concept of effective contact spots to evaluate the contribution of random contact status to the material removal process. Mechanical removal capacity and chemical reaction capacity parameters are defined to mathematically model the material removal process from a micro-scale chemical-mechanical synergistic perspective. Experimental observations and theoretical analysis confirm the importance of the micro-scale contact status and the dominant roles of the real contact ratio, radius, and spacing in determining the material removal rate for different materials.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2022)
Article
Optics
Zhengji Xu, Nanxi Li, Yuan Dong, Yuan Hsing Fu, Ting Hu, Qize Zhong, Yanyan Zhou, Dongdong Li, Shiyang Zhu, Navab Singh
Summary: Optical color filters are widely used in various fields, and structural color filters based on nanotechnology have advantages over traditional dye-based filters. The metasurface-based subtractive color filters demonstrated in this work show potential for high efficiency color filters on a CMOS-compatible platform.
PHOTONICS RESEARCH
(2021)
Article
Engineering, Mechanical
Lin Wang, Ping Zhou, Ying Yan, Changyu Hou, Dongming Guo
Summary: The study found that the material removal rate is related to the fluctuation of the friction force (stick-slip phenomenon) rather than the average coefficient of friction. Additionally, a waviness topography was observed on the polished surface, further confirming its origin from the stick-slip phenomenon.
TRIBOLOGY INTERNATIONAL
(2021)
Article
Engineering, Electrical & Electronic
Chulwoo Bae, Shinil Oh, Juhwan Kim, Donggeon Kwak, Seungjun Oh, Taesung Kim
Summary: This study investigates the effect of radial grooves (RG) pads on copper chemical mechanical polishing/planarization (CMP) process to improve its performance. The results show that increasing the number of RGs and the rotational speed of head/platen can enhance the slurry inflow/outflow, increase the Cu wafer removal rate, and improve the surface roughness of Cu wafers.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
Article
Physics, Applied
Le Nam Quoc Huy, Chun-Yu Lin, Chao-Chang A. Chen
Summary: This study evaluates the micro-topography model of a soft polishing pad and calibrates the material removal rate model for copper wafer through X-ray micro-computed tomography scan and finite element method simulation.
JAPANESE JOURNAL OF APPLIED PHYSICS
(2022)
Article
Nanoscience & Nanotechnology
Jiawei Li, Shuopei Wang, Lu Li, Zheng Wei, Qinqin Wang, Huacong Sun, Jinpeng Tian, Yutuo Guo, Jieying Liu, Hua Yu, Na Li, Gen Long, Xuedong Bai, Wei Yang, Rong Yang, Dongxia Shi, Guangyu Zhang
Summary: This study demonstrates the growth of monolayer MoSe2 on a 4-inch wafer by chemical vapor deposition, achieving wafer-scale continuity and uniformity of layer thickness.
Article
Engineering, Electrical & Electronic
Zhengzheng Bu, Fengli Niu, Jiapeng Chen, Zhenlin Jiang, Wenjun Wang, Xuehan Wang, Hanqiang Wang, Zefang Zhang, Yongwei Zhu, Tao Sun
Summary: A novel method of abrasive-free polishing of single crystal silicon was proposed and explored. By using a polishing pad pretreated with colloidal silica, the processing efficiency, stability and quality of single crystal silicon wafers were improved in abrasive-free slurries containing potassium carbonate, potassium silicate or potassium hydroxide.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
Article
Materials Science, Multidisciplinary
Mohit Sharma, Chao-Chang A. Chen
Summary: In this study, an analytical material removal model is established to predict the material removal in the chemical mechanical polishing (CMP) process. The model is compared with experimental results and a correlation between polishing pad and wafer properties and material removal is found.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2022)
Review
Green & Sustainable Science & Technology
Hyunseop Lee, Hyoungjae Kim, Haedo Jeong
Summary: This study reviews the importance of CMP in semiconductor manufacturing, its impact on the environment, methods to reduce environmental burden, and the future direction of CMP technology for sustainability.
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY
(2022)
Article
Materials Science, Ceramics
Chen Zhou, Xiangyang Xu, Lei Dai, Haiming Gong, Shuntian Lin
Summary: By utilizing electrostatic attraction, core-shell structured composite abrasives were assembled, enhancing polishing efficiency and surface quality, while increasing the polishing interface area.
CERAMICS INTERNATIONAL
(2021)
Article
Materials Science, Multidisciplinary
Weilei Wang, Weili Liu, Zhitang Song
Summary: The two-step CMP process using alumina and silica as abrasives for 4H-SiC wafer polishing achieved excellent surface roughness by adjusting the concentrations of KMnO4, pH, and H2O2. The maximum polishing rates and optimal conditions were determined for each step, resulting in a perfect surface with minimal roughness through precise control of process parameters. In-situ friction coefficients were utilized to characterize the two-step process and deduce the CMP mechanisms of the slurry.
ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
(2021)
Article
Engineering, Industrial
Xiaolong Han, Zhuji Jin, Qing Mu, Ying Yan, Ping Zhou
Summary: This paper describes the morphological characteristics of latent scratches using atomic force microscopy and develops a mathematical model to explain their formation mechanism. The observations show that the depth and width distributions of latent scratches are Gaussian-like. The proposed model explains that the formation of latent scratches is caused by plastic deformation of the crystal surface.
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
(2022)
Article
Chemistry, Multidisciplinary
Chien-Liang Liu, Chun-Jan Tseng, Wen-Hoar Hsaio, Sheng-Hao Wu, Shu-Rong Lu
Summary: This paper proposes a deep learning model called a fusion network for predicting the wafer material removal rate (MRR) in semiconductor manufacturing. The model separates features into shallow and deep features and learns the complex interactions among them through nonlinear transformations and feature embeddings. Experimental results show that the proposed model outperforms competitors and other methods.
APPLIED SCIENCES-BASEL
(2022)
Article
Engineering, Mechanical
Gengzhuo Li, Chen Xiao, Shibo Zhang, Shengquan Luo, Yuhan Chen, Yongbo Wu
Summary: To address the low polishing efficiency in traditional loose-abrasive chemical mechanical polishing, a humidity-controlled fixed-abrasive chemical mechanical polishing method using CeO2 pellet is proposed. Both nano-scratch tests and fixed-abrasive polishing experiments confirm the irreplaceable role of water molecules in silicon material removal, with higher humidity resulting in better removal. Fixed-abrasive polishing experiments under saturated humidity achieved a surface roughness below Ra 2 nm at an efficiency of 0.9 μm/h, with minimal stress on the polished surface. The method is proven effective for stress relief after grinding.
TRIBOLOGY INTERNATIONAL
(2023)
Article
Engineering, Manufacturing
Dewen Zhao, Yongyong He, Tongqing Wang, Xinchun Lu
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
(2012)
Article
Engineering, Manufacturing
Dewen Zhao, Tongqing Wang, Yongyong He, Xinchun Lu
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
(2013)
Article
Automation & Control Systems
Tongqing Wang, Dewen Zhao, Yongyong He, Xinchun Lu
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2013)
Article
Electrochemistry
Dewen Zhao, Yongyong He, Tongqing Wang, Xinchun Lu, Jianbin Luo
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
(2012)
Article
Engineering, Electrical & Electronic
Tongqing Wang, Xinchun Lu, Dewen Zhao, Yongyong He, Jianbin Luo
MICROELECTRONIC ENGINEERING
(2013)
Article
Engineering, Electrical & Electronic
Dewen Zhao, Tongqing Wang, Yongyong He, Xinchun Lu
MICROELECTRONIC ENGINEERING
(2013)
Article
Engineering, Electrical & Electronic
Zilian Qu, Qian Zhao, Yonggang Meng, Tongqing Wang, Dewen Zhao, Yanwu Men, Xinchun Lu
MICROELECTRONIC ENGINEERING
(2013)
Article
Instruments & Instrumentation
Hongkai Li, Zilian Qu, Qian Zhao, Fangxin Tian, Dewen Zhao, Yonggang Meng, Xinchun Lu
REVIEW OF SCIENTIFIC INSTRUMENTS
(2013)
Article
Engineering, Multidisciplinary
Wang TongQing, Lu XinChun, Zhao DeWen, He YongYong
SCIENCE CHINA-TECHNOLOGICAL SCIENCES
(2013)
Article
Engineering, Mechanical
Dewen Zhao, Yongyong He, Tongqing Wang, Xinchun Lu, Jianbin Luo
TRIBOLOGY INTERNATIONAL
(2013)