Effects of the Polishing Variables on the Wafer-Pad Interfacial Fluid Pressure in Chemical Mechanical Polishing of 12-Inch Wafer

Published 2012 View Full Article

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Title
Effects of the Polishing Variables on the Wafer-Pad Interfacial Fluid Pressure in Chemical Mechanical Polishing of 12-Inch Wafer
Authors
Keywords
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Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 159, Issue 3, Pages H342-H348
Publisher
The Electrochemical Society
Online
2012-01-18
DOI
10.1149/2.063203jes
References
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