Journal
SCIENCE CHINA-TECHNOLOGICAL SCIENCES
Volume 56, Issue 8, Pages 1974-1979Publisher
SCIENCE PRESS
DOI: 10.1007/s11431-013-5245-y
Keywords
chemical mechanical polishing; contact stress; non-uniformity; multi-zone polishing head; retaining ring
Funding
- Science Fund for Creative Research Groups [51021064]
- National Natural Science Foundation of China [51205226]
- China Postdoctoral Science Foundation [2012M510420]
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A finite element analysis (FEA) model is developed for the chemical-mechanical polishing (CMP) process on the basis of a 12-in five-zone polishing head. The proposed FEA model shows that the contact stress non-uniformity is less dependent on the material property of the membrane and the geometry of the retaining ring. The larger the elastic modulus of the pad, the larger contact stress non-uniformity of the wafer. The applied loads on retaining ring and zone of the polishing head significantly affect the contact stress distribution. The stress adjustment ability of a zone depends on its position. In particular, the inner-side zone has a high stress adjustment ability, whereas the outer-side zone has a low stress adjustment ability. The predicted results by the model are shown to be consistent with the experimental data. Analysis results have revealed some insights regarding the performance of the multi-zone CMP.
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