IEEE Transactions on Components Packaging and Manufacturing Technology
Note: The following journal information is for reference only. Please check the journal website for updated information prior to submission.
Journal Title
IEEE Transactions on Components Packaging and Manufacturing Technology
IEEE T COMP PACK MAN
ISSN / eISSN
2156-3950
Aims and Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Subject Area
ENGINEERING, ELECTRICAL & ELECTRONIC
MATERIALS SCIENCE, MULTIDISCIPLINARY
ENGINEERING, MANUFACTURING
CiteScore
4.40
View Trend
CiteScore Ranking
| Category | Quartile | Rank |
|---|---|---|
| Engineering - Industrial and Manufacturing Engineering | Q2 | #112/355 |
| Engineering - Electrical and Electronic Engineering | Q2 | #271/738 |
| Engineering - Electronic, Optical and Magnetic Materials | Q2 | #109/271 |
Web of Science Core Collection
| Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
|---|---|
| Indexed | - |
| Category (Journal Citation Reports 2023) | Quartile |
|---|---|
| ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE | Q3 |
| ENGINEERING, MANUFACTURING - SCIE | Q4 |
| MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE | Q3 |
H-index
39
Country/Area of Publication
UNITED STATES
Publisher
Institute of Electrical and Electronics Engineers Inc.
Year Publication Started
2011
Annual Article Volume
223
Open Access
NO
Contact
445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141
Verified Reviews
Submitted 14-Jun-2023;
Decisioned 14-Jun-2023. EIC Reject (14-Jun-2023).
Translation:
The manuscript with the code TCPMT-2023-29X was submitted on June 14, 2023. The decision on the manuscript was made on the same day, June 14, 2023. The Editor-in-Chief rejected the manuscript on June 14, 2023.
Unfortunately, we find it necessary to reject the manuscript because the subject matter is outside the technical scope of this publication.
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