Foreword Special Section on “Evolving Trends in Electrical Modeling, Validation, and Signal and Power Integrity Analysis in Electronic Packaging and Systems”

Title
Foreword Special Section on “Evolving Trends in Electrical Modeling, Validation, and Signal and Power Integrity Analysis in Electronic Packaging and Systems”
Authors
Keywords
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Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2023-10-20
DOI
10.1109/tcpmt.2023.3320328

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