Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability

Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound

(2023) Junmo Kim et al.   POLYMER TESTING

Recent Advances and Trends in Advanced Packaging

(2022) John H. Lau   IEEE Transactions on Components Packaging and Manufacturing Technology

Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process

(2022) Chuan Chen et al.   Materials

Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration

(2021) SivaChandra Jangam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages

(2021) Mengkai Shih et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges

(2021) Ming-Yi Tsai et al.   Materials

Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load

(2021) Yang Liu et al.   MICROELECTRONICS RELIABILITY

Chiplet Heterogeneous Integration Technology—Status and Challenges

(2020) Tao Li et al.   Electronics

Design guideline on board-level thermomechanical reliability of 2.5D package

(2020) Shuai Shao et al.   MICROELECTRONICS RELIABILITY

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

(2019) Sinan Su et al.   JOURNAL OF ELECTRONIC PACKAGING

Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies

(2018) Ming-Yi Tsai et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Study on Warpage and Reliability of Fan-Out Interposer Technology

(2018) Fa Xing Che et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

CMOS Scaling Trends and Beyond

(2017) Mark T. Bohr et al.   IEEE MICRO

Electrical–Thermal Characterization of Through Packaging Vias in Glass Interposer

(2017) Libo Qian et al.   IEEE TRANSACTIONS ON NANOTECHNOLOGY

Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing

(2017) Cheolgyu Kim et al.   MICROELECTRONICS RELIABILITY

A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization

(2017) Yuling Niu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost

(2017) Brett M. D. Sawyer et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Measurement of Elastic Properties of Epoxy Molding Compound by Single Cylindrical Configuration with Embedded Fiber Bragg Grating Sensor

(2016) Y. Sun et al.   EXPERIMENTAL MECHANICS

Prediction of deformation during manufacturing processes of silicon interposer package with TSVs

(2016) Yeonsung Kim et al.   MICROELECTRONICS RELIABILITY

Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

(2013) J.H. Lee et al.   INTERNATIONAL JOURNAL OF FATIGUE

Impact of processing conditions and solder materials on surface mount assembly defects

(2011) Rajen S. Sidhu et al.   JOM

Determination of Anand parameters for SnAgCuCe solder

(2009) Liang Zhang et al.   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING