Guest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling

Published 2023 View Full Article

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Title
Guest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling
Authors
Keywords
-
Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Volume 13, Issue 8, Pages 1085-1087
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2023-09-20
DOI
10.1109/tcpmt.2023.3308669

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