Numerical investigation on the temperature effect in nanometric cutting of polycrystalline silicon

标题
Numerical investigation on the temperature effect in nanometric cutting of polycrystalline silicon
作者
关键词
Molecular dynamics simulation, Nanometric cutting, Polycrystalline silicon, Subsurface damage, Material removal mechanism
出版物
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
Volume 220, Issue -, Pages 107172
出版商
Elsevier BV
发表日期
2022-03-03
DOI
10.1016/j.ijmecsci.2022.107172

向作者/读者发起求助以获取更多资源

Reprint

联系作者

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now