Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

出版年份 2016 全文链接

标题

作者

关键词

Molecular dynamics, Monocrystalline silicon, Thickness, Damage layer, Multiple grinding

出版物

Volume 51, Issue -, Pages 15-19

出版商

Elsevier BV

发表日期

2016-05-07

DOI

10.1016/j.mssp.2016.04.013

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