Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation

Highly uniform microfluidic electroless interconnections for chip stacking applications

(2021) H.T. Hung et al.   ELECTROCHIMICA ACTA

Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores

(2020) Xing Qiu et al.   JOURNAL OF ELECTRONIC PACKAGING

Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

(2018) I.A. Weng et al.   SCRIPTA MATERIALIA

Electroless copper deposition: A critical review

(2018) Swatilekha Ghosh   THIN SOLID FILMS

Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating

(2017) H. T. Hung et al.   JOURNAL OF ELECTRONIC MATERIALS

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

(2017) Wen-Wei Shen et al.   Nanoscale Research Letters

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)

(2017) Wen-Wei Shen et al.   Nanoscale Research Letters

Cu filling of TSV using various current forms for three‐dimensional packaging application

(2013) Myong‐Hoon Roh et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Structural design guideline to minimize extreme low-k delamination potential in 40nm flip-chip packages

(2012) Yi-Shao Lai et al.   MICROELECTRONICS RELIABILITY

Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

(2012) K.N. Tu et al.   MICROELECTRONICS RELIABILITY

Copper Electroless Bonding of Dome-Shaped Pillars for Chip-to-Package Interconnect

(2011) Hyo-Chol Koo et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems

(2009) Jian-Qiang Lu   PROCEEDINGS OF THE IEEE

All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization

(2008) Tyler Osborn et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY