期刊
THIN SOLID FILMS
卷 669, 期 -, 页码 641-658出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.tsf.2018.11.016
关键词
Electroless deposition; Reducing agents; Copper films; Non-conducting substrate
类别
资金
- Department of Science & Technology, Govt. of India
This paper reviews recent progress on electroless copper deposition, primarily on non-conducting substrate surfaces including glass, polymers and resins for applications in electrical and electronics products and services. The review focuses on the research of bath parameters that affect the film fabrication process which influences the physical, chemical and electrical properties of the deposits. Fundamental aspects underlying the coating process are described in detail with the aim of summarizing existing application and highlighting new areas for future research. Finally, a comparison between electroless and electrodeposition technology is presented in order to evaluate their suitability for industrial technologies.
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