Article
Chemistry, Physical
Iakovos Yakoumis
Summary: Due to the strict European exhaust emissions standards, there is a high demand for reducing toxic gas emissions from vehicles. Car manufacturers have implemented various catalytic devices to comply with the standards, with the Prometheus catalyst using copper as an active phase to reduce precious metal loading and achieve similar or improved catalytic performance compared to commercial catalysts.
Article
Chemistry, Physical
Fengjuan Yang, Dongliang Huo, Jinglin Zhang, Tongyao Lin, Jingxian Zhang, Shaozao Tan, Lili Yang
Summary: A coating containing graphene oxide and copper was prepared on the surface of titanium sheet, which showed excellent antibacterial properties and low toxicity to cells.
JOURNAL OF COLLOID AND INTERFACE SCIENCE
(2023)
Article
Materials Science, Multidisciplinary
Jong-Sung Lee, Young-Joo Lee, Jaegeun Seol, Young-Chang Joo, Byoung-Joon Kim
Summary: This study successfully reduced the mechanical damage of interconnects in highly integrated flexible electronics by introducing an interconnect architecture that bypassed the strain concentration area. It is expected to improve the design guidelines for mechanically reliable interconnects.
ELECTRONIC MATERIALS LETTERS
(2023)
Article
Engineering, Electrical & Electronic
Maximilian Schmid, Andreas Zippelius, Alexander Hanss, Stephan Boeckhorst, Gordon Elger
Summary: Thermo-mechanical reliability is a major issue in solid-state lighting. A reliability study with 1800 samples is conducted to investigate the effects of LED package design and solder material on LED module degradation. The study reveals that initial thermal performance is independent of solder paste type and voiding is more critical to smaller LED packages. Lower silver proportion in the paste is found to increase voiding.
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
(2022)
Article
Engineering, Manufacturing
Kazi Moshiur Rahman, Amanda Wei, Hadi Miyanaji, Christopher B. Williams
Summary: In binder jetting additive manufacturing, the liquid binder plays a crucial role in binding the powder particles together and providing structural integrity to the green parts. However, the impact of the binder on part densification and subsequent part properties is still not well understood. This study investigates the influence of the binder on densification through a new approach called shell printing, which allows for varying the amount of binder content in the green parts. By selectively depositing the binder around the part surface, the packed powders are trapped inside the bound shell geometry and can be sintered to densify the part. Manipulating the shell thickness enables the exploration of the effects of the binder content on the process-structure-property relationships.
ADDITIVE MANUFACTURING
(2023)
Article
Green & Sustainable Science & Technology
Hualong Wang, Susanna Vu, Julia Pignanelli, Tamer Abdel Fatah, John F. Trant, Sara Mahshid, Simon Rondeau-Gagne, Mohammed Jalal Ahamed
Summary: This paper presents a novel self-healable and stretchable microfluidics system for wearable lab-on-a-chip applications, using an imine-based precursor with various metal sources for development and mold transfer method for fabrication of microfluidic devices on a self-healing substrate layer. The mechanical properties and microfluidic characteristics of the resulting devices were evaluated, demonstrating their performance in classical microfluidic applications. Scanning-electron microscopy was used to characterize the new microfluidic devices, showing their mold transfer capability.
ADVANCED SUSTAINABLE SYSTEMS
(2022)
Review
Chemistry, Analytical
Gaspar Rego, Paulo Caldas, Oleg Ivanov
Summary: This work reviews the significant achievements of INESC TEC in fabricating long-period fiber gratings using the electric arc technique, focusing on the fabrication setup, fiber type, and fabrication parameters' effects on the gratings' transmission spectra. The theory and mechanisms responsible for the formation of the gratings are discussed, supported by measurements of the fiber temperature during electric arc discharge.
Article
Chemistry, Physical
B. Dousti, S. Babu, N. Geramifard, M. Y. Choi, J. B. Lee, S. F. Cogan, G. S. Lee
Summary: Recent research efforts have focused on developing lightweight, thin, and flexible micro-scale supercapacitors for integration into chip power source devices. The ultra-thin flexible microsupercapacitors based on highly aligned horizontal array of carbon nanotubes exhibit excellent flexibility and outstanding bending durability. The electrolyte deposition technique affects the performance of the supercapacitors, with drop-cast devices showing higher specific capacitance but less flexibility compared to spin-coated devices.
JOURNAL OF POWER SOURCES
(2022)
Article
Chemistry, Physical
Xiao Wang, Wenwen Chen, Xiaoyu Shi, Pratteek Das, Shuanghao Zheng, Jianhua Qin, Chenglin Sun, Zhong-Shuai Wu
Summary: The rapid development of smart wearable microdevices has created a demand for micro-supercapacitors (MSCs) with various form factors. However, conventional bulky stacked geometries, rigid substrates, and complex manufacturing processes have hindered their practical application. This study presents a microfluidics-assisted fabrication strategy that utilizes capillary action to customize planar MSCs, featuring a substrate-free configuration using polyvinyl alcohol hydrogel. The resulting MSCs demonstrate high conductive polymer-based microelectrodes, showing excellent areal capacitance and remarkable capacitance retention. The substrate-free MSCs also exhibit extraordinary flexibility and stretchability. This exploration of microfluidics-assisted fabrication proves to be a reliable strategy for high-performance standalone microelectronics with in-plane configuration.
ADVANCED ENERGY MATERIALS
(2023)
Article
Engineering, Electrical & Electronic
Houqiang Fu, Kai Fu, Srabanti Chowdhury, Tomas Palacios, Yuji Zhao
Summary: This comprehensive review discusses the recent progress in vertical GaN power devices, focusing on device design principles and fabrication processes. It covers basic structures, fabrication processes, and device physics, including materials and device engineering aspects. Key topics such as avalanche breakdown and leakage mechanisms are also discussed, providing valuable information for researchers and inspiring future interdisciplinary collaborations.
IEEE TRANSACTIONS ON ELECTRON DEVICES
(2021)
Article
Chemistry, Analytical
Junjie Chen, Suyang Li, Fuqi Yao, Wanbing Xu, Yunfeng Li, Qiang Chen, Pei Liang
Summary: In this study, a high-throughput method for the preparation of monodisperse submicron silver particles using S-shaped microfluidic chips was demonstrated. The particle size and morphology of the silver particles could be controlled by adjusting the concentration of the reducing agent ascorbic acid and the stabilizer PVP. The synthesized submicron silver particles showed ultra-sensitive SERS detection, with a detection limit of 10(-9) M for rhodamine 6G (R6G).
Article
Materials Science, Multidisciplinary
Haesung Park, Hankyeol Seo, Sarah Eunkyung Kim
Summary: Protecting the copper surface from oxidation is crucial for Cu-Cu bonding, and the copper nitride nanolayer can effectively prevent further oxidation, lowering the bonding temperature of Cu-Cu bonding.
ELECTRONIC MATERIALS LETTERS
(2021)
Article
Optics
Randhir Kumar, Dustin Dzikonski, Elena Bekker, Robert Vornhusen, Valerio Vitali, Joerg Imbrock, Cornelia Denz
Summary: This article demonstrates the fabrication of 3D cell-like structures using a femtosecond laser-based two-photon polymerization technique. The structures resemble the morphological and biomechanical characteristics of natural cells and can be interchangeably filled with precursor solutions without impairing the microstructures. The combination of two-photon polymerization and microrheological measurements by optical tweezers provides a powerful toolbox for future investigations into cell mimic and artificial cell studies.
Article
Engineering, Electrical & Electronic
Hao Lo, William Moy, Hanzhao Yu, Sachin Sapatnekar, Chris H. Kim
Summary: Quantum-inspired computing systems with large hardware topologies are developed to efficiently solve combinatorial optimization problems. A physics-based Ising solver chip is reported, featuring an all-to-all architecture with 48 spins and a highly uniform coupling circuit. The chip allows arbitrary problem graphs with up to 48 nodes to be directly mapped to the hardware and quickly solved.
NATURE ELECTRONICS
(2023)
Article
Materials Science, Multidisciplinary
Rong Wang, Lianbi Li, Lei Li, Changjun Zhu, Zebin Li, Lin Cheng, Song Feng, Guoqing Zhang, Yuan Zang, Jichao Hu, Yongkang Xu
Summary: A flexible near-infrared photodetector was fabricated by growing a Ge/Gr heterojunction using pulsed laser deposition and transferring it onto a flexible polyimide substrate. The transferred heterojunction showed no significant changes in Raman spectra, indicating successful transfer. The Ge/Gr heterojunction exhibited enhanced absorption characteristics, high rectification ratio, and stable photoresponse to NIR light.
