Article
Chemistry, Physical
Mu-Ping Hsu, Chi-Yu Chen, Hsin-Chi Chang, Zhong-Jie Hong, Ming-Wei Weng, Kuan-Neng Chen
Summary: The Cu-Cu bonding technology is crucial for heterogeneous integration and overcoming the limitations of transistor miniaturization. This study presents a next-generation passivation bonding technology that allows chips to be bonded at temperatures below 200°C, simplifying the complex process. The investigation of area-selective films and bonding mechanism using transmission electron microscope (TEM) reveals exceptional film quality and bonded reliability.
APPLIED SURFACE SCIENCE
(2023)
Article
Chemistry, Physical
Yaofang Hu, Lishuang Xiong, Ming Li, Tao Hang
Summary: The study introduces a cost-effective wet deposition path for fabricating PAA insulation films and nickel diffusion barriers on silicon substrate, providing a stable interface between polymer insulation layers and nickel diffusion barrier.
APPLIED SURFACE SCIENCE
(2022)
Article
Electrochemistry
H. T. Hung, Z. D. Ma, P. S. Shih, J. H. Huang, L. Y. Kao, C. Y. Yang, Vengudusamy Renganathan, C. L. Kao, Y. C. Hung, C. R. Kao
Summary: The study achieved high uniformity microfluidic electroless bonding processes for the vertical interconnection between Cu pillars at very low bonding temperature and without pressure. Different flow patterns were investigated, and the key parameters influencing bonding uniformity were found to be flow rate, stay time, and reverse flow.
ELECTROCHIMICA ACTA
(2021)
Article
Engineering, Environmental
Wanli Li, Lingying Li, Qingqing Sun, Xuying Liu, Masayuki Kanehara, Tomonobu Nakayama, Jinting Jiu, Kenji Sakamoto, Takeo Minari
Summary: In this study, a novel additive manufacturing approach using surface-activation-localized electroless plating (SALEP) was reported for selectively depositing high-resolution multi-metal layers and fabricating high-performance electronic devices for flexible electronics. The SALEP approach allows for layer-by-layer deposition of multi-metal patterns without the need for subtractive lithography, enabling the fabrication of OTFT arrays with high hole mobility. This low-cost and scalable method offers a promising solution for the development of high-performance flexible electronic devices.
CHEMICAL ENGINEERING JOURNAL
(2021)
Letter
Chemistry, Physical
P. S. Shih, C. H. Huang, C. R. Kao
Summary: High-density Cu nanotwins in columnar grains were successfully fabricated using a formaldehyde-based electroless plating solution. Additives induced the crystallization of the nanotwinned structure, and the deposited Cu nanotwins had a high percentage of (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process make this method promising for future applications in the electronics industry.
JOURNAL OF ALLOYS AND COMPOUNDS
(2023)
Article
Chemistry, Physical
Dongxu Huang, Mingqi Huang, Deliang Sun, Bincan Liu, Rui Xuan, Jinshan Liu, Rong Sun, Jinhui Li, Guoping Zhang, Daquan Yu
Summary: This study successfully improved the adhesion strength between copper and glass by preparing ZnO coating on the glass surface, achieving a high adhesion strength of up to 5B. Furthermore, a specific chemical was used to create an optional hydrophobic surface, allowing for selective electroless copper plating patterns.
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
(2021)
Article
Materials Science, Multidisciplinary
Virgilio Genova, Laura Paglia, Giovanni Pulci, Giulia Pedrizzetti, Alice Pranzetti, Marco Romanelli, Francesco Marra
Summary: A new lead-free electroless Ni-P plating solution was developed for the production of coatings with different phosphorus content. By optimizing the solution composition and studying the treatment methods, the optimal deposition conditions were determined, and the effect of heat treatment on the coatings was investigated.
Article
Materials Science, Multidisciplinary
Daegon Lee, Bo-Young Kim, Chan Ho Park, Gwajeong Jeong, Seong-Dae Park, Myong Jae Yoo, Hyunseung Yang, Woo Sung Lee
Summary: This study successfully demonstrated the precise fabrication of copper patterns on 3D printed structures, offering a universal and cost-effective approach for extending 3D printing applications and creating practical tools for customized electronic devices.
ACS APPLIED POLYMER MATERIALS
(2021)
Article
Materials Science, Multidisciplinary
Qia Zhang, Ling Kang, JianXiong Zou, Chun Huang, Zhiwei Gong, Jian Zhang
Summary: This paper proposes a new method for sustainable and low-cost metallization of cellulose paper, achieving good electrical conductivity and mechanical flexibility. The method employs modified electroless plating processes without the use of noble metal activators and corrosive chemicals. The results show successful metallization of cellulose paper with Ni-P and Au/Ni-P, with the Au/Ni-P/CP composites demonstrating excellent electrical conductivity and mechanical flexibility.
MATERIALS & DESIGN
(2021)
Article
Engineering, Chemical
Kai Yan, Peisen Huang, Mingzhu Xia, Xingen Xie, Lin Sun, Wu Lei, Fengyun Wang
Summary: This study used electrodialysis and electrodeposition combined method to treat the spent electroless nickel plating bath, and the experimental results showed that this method has the ability of high recovery of Ni2+ and removal of HPO32-, with low energy consumption.
SEPARATION AND PURIFICATION TECHNOLOGY
(2022)
Article
Materials Science, Multidisciplinary
Myeong In Kim, Jong-Hyun Lee
Summary: The study utilized Cu@Ag particulate preform for pressure-assisted sinter bonding between an Ag-finished die and an Ag-finished substrate in air, achieving rapid bondline formation with high-temperature sustainability, low-defect structure, and high thermal conductivity. Experimental results showed that bonding at 350 degrees C and pressures of 5 MPa and 10 MPa could rapidly reach shear strength values of up to 20 and 24 MPa, respectively, forming a bondline with near-full density structure.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2021)
Article
Materials Science, Multidisciplinary
Caterina Credi, Roberto Bernasconi, Marinella Levi, Luca Magagnin
Summary: This article presents a straightforward and low-cost method that combines stereolithography (SLA) and selective electroless metallization (EM) for the fabrication of 3D parts with complex shapes and end-use multifunctionalities. A novel photocurable composite based on acrylate resin loaded with nickel (Ni) particles is developed for high-resolution SLA printing with self-catalytic properties. The metallized SLA cured samples exhibit good electrical and magnetic properties and improved robustness compared to their non-loaded counterparts. Selective metallization of 3D printed parts is achieved through multi-material SLA printing with strong adhesion at the interface, providing a cost-effective approach for rapid prototyping of functional free-form features on 3D structures.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2023)
Article
Engineering, Electrical & Electronic
Gaelle A. L. Andreatta, Nicholas R. Hendricks, Aurelie Grivel, Mathieu Billod
Summary: A process has been developed to produce highly adhesive metallic layers onto polymeric surfaces for applications in the field of radiofrequency components. This process utilizes wet deposition and electroless plating techniques to graft a dense polyelectrolyte layer onto plastic surfaces, allowing for conformal metallization. The method is versatile, environmentally friendly, and adaptable to different polymeric substrates and three-dimensional geometries.
ACS APPLIED ELECTRONIC MATERIALS
(2022)
Review
Engineering, Electrical & Electronic
Claudia Turro, Walter J. Dressick
Summary: The electroless plating technology is critically important for various industries such as automotive, aerospace, machine tools, and especially electronics. Since the mid-20th century, this technology has evolved from plating a few industrially important metals to a wide range of elements, enabling progress and new applications. This review provides a collection and survey of available electroless processes organized by the periodic table, offering examples to showcase the field's advancements. It concludes with an outlook for future developments and a challenge to scientists and engineers to explore new applications.
ACS APPLIED ELECTRONIC MATERIALS
(2022)
Article
Materials Science, Coatings & Films
Jui-Lin Chao, Si-Wei Lin, Jing-Chie Lin, Yi-Hung Liu, Chih-Yuan Hsiao, Freeze Wang, Nico Li, Albert T. Wu
Summary: Electroless and electroplated single-layer Ni and multilayer Ni/Pd/Au were used as surface finishing materials for automobile device substrates. The electroless Ni and multilayer Ni/Pd/Au exhibited better corrosion resistance compared to their well-crystalline electroplated and electroless counterparts, respectively, when exposed to various gaseous SO2 concentrations. Galvanically displaced Pd and immersion Au provided more diffusion paths for corrosion product growth on the electroless Ni/Pd/Au surface, leading to enhanced corrosion resistance.
SURFACE & COATINGS TECHNOLOGY
(2023)
Article
Biochemistry & Molecular Biology
Jyuhn-Huarng Juang, Chen-Yi Chen, Chen-Wei Kao, Yu-Wen Huang, Tai-Yu Chiu, Chiung-Tong Chen
Summary: The study found that the DPP-IV inhibitor LAF237 can improve glucose tolerance and increase graft beta-cell mass in diabetic mice transplanted with a sufficient number of islets. This suggests that the effects of DPP-IV inhibitors are influenced by the implanted islet mass.
BIOMEDICAL JOURNAL
(2021)
Article
Electrochemistry
H. T. Hung, Z. D. Ma, P. S. Shih, J. H. Huang, L. Y. Kao, C. Y. Yang, Vengudusamy Renganathan, C. L. Kao, Y. C. Hung, C. R. Kao
Summary: The study achieved high uniformity microfluidic electroless bonding processes for the vertical interconnection between Cu pillars at very low bonding temperature and without pressure. Different flow patterns were investigated, and the key parameters influencing bonding uniformity were found to be flow rate, stay time, and reverse flow.
ELECTROCHIMICA ACTA
(2021)
Article
Chemistry, Analytical
Vengudusamy Renganathan, Ramachandran Balaji, Shen-Ming Chen, Narendhar Chandrasekar, Selvarasu Maheshwaran, C. R. Kao
Summary: Through research and experiments, we have developed a novel bimetallic nanocomposite SiO2/NiS2 sensor for the determination and elimination of pollutants in the environment, such as catechol and dyes. The sensor exhibits high sensitivity, low detection limit, and a wide linear range, enabling rapid and effective detection and removal of pollutants.
Article
Chemistry, Physical
Chin-Hao Tsai, Wei-Chen Huang, Chengheng Robert Kao
Summary: A novel method of sintering silver joints using silver-indium alloy paste is demonstrated in this paper, which improves the reliability of sintered silver joints by inhibiting pore coarsening and enhancing mechanical properties at high temperatures.
Article
Nanoscience & Nanotechnology
Pei-Tzu Lee, Wan-Zhen Hsieh, Cheng-Yu Lee, Shao-Chin Tseng, Mau-Tsu Tang, Ching-Yu Chiang, C. R. Kao, Cheng-En Ho
Summary: The study found a noticeable compressive deviatoric stress at the anode of Sn strips, particularly in the roots of Sn whiskers, confirming that electromigration-induced atomic accumulation occurred downstream in a strip and that Sn whiskering was closely related to internal stress resulting from atomic accumulation in confined segments.
SCRIPTA MATERIALIA
(2022)
Article
Chemistry, Multidisciplinary
Jyuhn-Huarng Juang, Jiun-Jie Wang, Chia-Rui Shen, Sung-Han Lin, Chen-Yi Chen, Chen-Wei Kao, Chen-Ling Chen, Shu-Ting Wu, Zei-Tsan Tsai, Yun-Ming Wang
Summary: The study shows that manganese magnetism-engineered iron oxide nanoparticles (MnMEIO NPs) conjugated with exendin-4 (Ex4) can act as a contrast agent for directly tracing implanted mouse islet beta-cells using magnetic resonance imaging (MRI). This technology can also be used to track implanted porcine neonatal pancreatic cell clusters (NPCCs) containing ducts, endocrine, and exocrine cells. The MnMEIO-Ex4 NPs are excellent contrast agents for detecting and long-term monitoring implanted NPCCs by MRI.
Article
Environmental Sciences
Selvarasu Maheshwaran, Vengudusamy Renganathan, Shen-Ming Chen, Ramachandran Balaji, C. R. Kao, Narendhar Chandrasekar, Selvarajan Ethiraj, Melvin S. Samuel, Muthusamy Govarthanan
Summary: A hybrid AgWO4-rGO nanocomposite electrode was successfully constructed by hydrothermal method for the rapid electrochemical detection of harmful pesticides. The nanocomposite exhibited excellent catalytic activity and ultrasensitive detection limit, with good selectivity and reproducibility for real water samples.
Article
Chemistry, Physical
Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang, C. R. Kao
Summary: The study found that after aging micro-bumps, the intermetallic compounds (IMCs) demonstrated better adhesive behavior with the Ti adhesion layer, without affecting the strength of the bumps.
Article
Multidisciplinary Sciences
Hiroaki Tatsumi, C. R. Kao, Hiroshi Nishikawa
Summary: Solid-state bonding has gained attention as an alternative to conventional solders in electronic packaging applications. Surface-nanostructured materials enable bonding at low temperature and pressure without complex modifications. This study used molecular dynamics simulations to investigate the bonding behavior between surface-nanostructured Cu and Au, revealing that larger specific surface area leads to faster densification at the bonding interface. Atomic displacement analysis showed preferential diffusion along NS-Cu cavities, with diffusion coefficients higher than surface diffusion coefficients. The highly disordered atomic arrangement allowed significant atomic diffusion, confirming the potential of surface-nanostructured materials in bonding technology for electronics.
SCIENTIFIC REPORTS
(2022)
Article
Materials Science, Multidisciplinary
Chin-Hao Tsai, Han-Tang Hung, Fu-Ling Chang, Steffen Bickel, Maik Mueller, Iuliana Panchenko, Karlheinz Bock, C. R. Kao
Summary: Sn/In-Sn bonding interfaces obtained through transient liquid phase (TLP) reaction were investigated for low-temperature assembly. Bonding was achieved at temperatures below 150 degrees C and low pressure. Although some voids were formed at the interfaces after bonding, the low eutectic temperature of In-Sn metallization enabled low-temperature bonding. A bonding mechanism for this novel low-temperature In-Sn assembly was proposed.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2022)
Article
Materials Science, Multidisciplinary
Wei Chen Huang, Chin Hao Tsai, Pei Tzu Lee, C. R. Kao
Summary: A novel die attach material consisting of silver-tin (Ag-Sn) alloy particles is developed in this study, fabricated by high-energy ball milling technique for high-temperature reliability. The sintered Ag-Sn alloy joints exhibit a stable microstructure without pore coarsening and oxidation at high temperatures, maintaining high bonding strength.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2022)
Article
Electrochemistry
J. H. Huang, P. S. Shih, V Renganathan, S. J. Grafner, Y. A. Chen, C. H. Huang, C. L. Kao, Y. S. Lin, Y. C. Hung, C. R. Kao
Summary: This study examines the plating characteristics of high copper concentration electroless copper plating solution and reveals the factors influencing plating rate and decomposition time. The results show that temperature and pH are important factors for plating rate, while copper sulfate concentration has an impact on decomposition time. The optimized formulation for high copper concentration solution requires 0.18M copper sulfate, which is over four times higher than conventional solutions.
ELECTROCHIMICA ACTA
(2022)
Article
Chemistry, Physical
Fu-Ling Chang, Yu-Hsin Lin, Han-Tang Hung, Chen-Wei Kao, C. R. Kao
Summary: In this study, cryogenic broad Ar+ beam ion milling was used to investigate the interfacial reaction between In-48Sn and Cu during soldering. Cu-6(Sn,In)5 and Cu(In,Sn)2 were confirmed as the main intermetallic compounds formed. The microstructure evolution and growth mechanism of Cu-6(Sn,In)5 during soldering were proposed. Additionally, the Young's modulus and hardness of Cu-6(Sn,In)5 were determined.
Proceedings Paper
Engineering, Electrical & Electronic
S. T. Grafner, J. H. Huang, Y. A. Chen, P. S. Shih, C. H. Huang, C. R. Kao
Summary: The study compares the numerical simulation models of rectangular and diamond arrays of pillars and finds that larger pillar diameter, lower pitch-to-diameter ratio, higher height-to-diameter ratio, and higher superficial velocity can achieve lower pressure drop. The rectangular pattern is more likely to form vortices between the wake and front region of the pillars and form a focused stream between the side areas of the pillars. On the other hand, the diamond pattern is less likely to generate vortices and favors to form an S-shaped stream through the arrangement of pillars. The pressure drop of the diamond pattern tends to be higher for larger pillar diameter, higher pitch-to-diameter ratio, and higher height-to-diameter ratio.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Yung-Sheng Lin, Yun-Ching Hung, Chin-Li Kao, Chung-Hung Lai, Po-Shao Shih, Jeng-Hau Huang, David Tarng, C. Robert Kao
Summary: This study focused on the MELI process for direct Cu-to-Cu bonding, investigating the bonding behavior and microstructure of the electroless Cu. The researchers also proposed a horizontal side-by-side MELI-Cu method that showed higher tolerance and competitiveness compared to vertical interconnections.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Article
Nanoscience & Nanotechnology
Jie Zhang, Xiaoyang Chen, MingJian Ding, Jiaqiang Chen, Ping Yu
Summary: This study enhances the compositional inhomogeneity of relaxor ferroelectric thin films to improve their dielectric temperature stability. The prepared films exhibit a relatively high dielectric constant and a very low variation ratio of dielectric constant over a wide temperature range.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Xiaoyu Chen, Ranran Zhang, Hao Zou, Ling Li, Qiancheng Zhu, Wenming Zhang
Summary: Polyaniline-manganese dioxide composites exhibit high conductivity, long discharge platform, and stable circulation, and the specific capacity is increased by providing additional H+ ions to participate in the reaction.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Xutao Huang, Yinping Chen, Jianjun Wang, Gang Lu, Wenxin Wang, Zan Yao, Sixin Zhao, Yujie Liu, Qian Li
Summary: This study aims to establish a novel approach to better understand and predict the behavior of materials with multi-scale lamellar microstructures. High-resolution reconstruction and collaborative characterization methods are used to accurately represent the microstructure. The mechanical properties of pearlite are investigated using crystal plasticity simulation and in-situ scanning electron microscopy tensile testing. The results validate the reliability of the novel strategy.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Cheng Chen, Fanchao Meng, Jun Song
Summary: This study systematically investigated the unfaulting mechanism of single-layer interstitial dislocation loops in irradiated L12-Ni3Al. The unfaulting routes of the loops were uncovered and the symmetry breaking during the unfaulting processes was further elucidated. A continuum model was formulated to analyze the energetics of the loops and predict the unfaulting threshold.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Darshan Bamney, Laurent Capolungo
Summary: This work investigates the formation of adjoining twin pairs (ATPs) at grain boundaries (GBs) in hexagonal close-packed (hcp) metals, focusing on the co-nucleation (CN) of pairs of deformation twins. A continuum defect mechanics model is proposed to study the energetic feasibility of CN of ATPs resulting from GB dislocation dissociation. The model reveals that CN is preferred over the nucleation of a single twin variant for low misorientation angle GBs. Further analysis considering GB character and twin system alignment suggests that CN events could be responsible for ATP formation even at low m' values.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Bing Han, Zhengqian Fu, Guoxiang Zhao, Xuefeng Chen, Genshui Wang, Fangfang Xu
Summary: This study investigates the behavior of electric-field induced antiferroelectric to ferroelectric (AFE-FE) phase transition and reveals the evolution of atomic displacement ordering as the cause for the transition behavior changing from sharp to diffuse. The novel semi-ordered configuration results from the competing interaction between long-range displacement modulation and compositional inhomogeneity, which leads to a diffuse AFE-FE transition while maintaining the switching field.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Akib Jabed, Golden Kumar
Summary: This study demonstrates that cryogenic rejuvenation promotes homogeneous-like flow and increases ductility in metallic glass samples. Conversely, annealing has the opposite effect, resulting in a smoother fracture surface.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Xin Ji, Yan Chong, Satoshi Emura, Koichi Tsuchiya
Summary: A heterogeneous microstructure in Ti-15Mo-3Al alloy with heterogeneous distributions of Mo element and omega(iso) precipitates has achieved a four-fold increase in tensile ductility without a loss of tensile strength, by blocking the propagation of dislocation channels and preventing the formation of micro-cracks.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Amit Samanta, Prasanna Balaprakash, Sylvie Aubry, Brian K. Lin
Summary: This study proposes a combined large-scale first principles approach with machine learning and materials informatics to quickly explore the chemistry-composition space of advanced high strength steels (AHSS). The distribution of aluminum and manganese atoms in iron is systematically explored using first principles calculations to investigate low stacking fault energy configurations. The use of an automated machine learning tool, DeepHyper, speeds up the computational process. The study provides insights into the distribution of aluminum and manganese atoms in systems containing stacking faults and their effects on the equilibrium distribution.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Guowei Zhou, Yuanzhe Hu, Zizheng Cao, Myoung Gyu Lee, Dayong Li
Summary: In this work, a physics-constrained neural network is used to predict grain-level responses in FCC material by incorporating crystal plasticity theory. The key feature, shear strain rate of slip system, is identified based on crystal plasticity and incorporated into the loss function as physical constitutive equations. The introduction of physics constraints accelerates the convergence of the neural network model and improves prediction accuracy, especially for small-scale datasets. Transfer learning is performed to capture complex in-plane deformation of crystals with any initial orientations, including cyclic loading and arbitrary non-monotonic loading.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Pengfei Yang, Qichang Li, Zhongying Wang, Yuxiao Gao, Wei Jin, Weiping Xiao, Lei Wang, Fusheng Liu, Zexing Wu
Summary: In this study, the HER performance of Ru-based catalysts is significantly improved through the dual-doping strategy. The obtained catalyst exhibits excellent performance in alkaline freshwater and alkaline seawater, and can be stably operated in a self-assembled overall water splitting electrolyzer.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Ilias Bikmukhametov, Garritt J. Tucker, Gregory B. Thompson
Summary: Depositing a Ni-1at. % P film can facilitate the formation of multiple quintuple twin junctions, resulting in a five-fold twin structure and a pentagonal pyramid surface topology. The ability to control material structures offers opportunities for creating novel surface topologies, which can be used as arrays of field emitters or textured surfaces.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Zening Yang, Weiwei Sun, Zhengyu Sun, Mutian Zhang, Jin Yu, Yubin Wen
Summary: Multicomponent oxides (MCOs) have wide applications and accurately predicting their thermal expansion remains challenging. This study introduces an innovative attention-based deep learning model, which achieves improved performance by using two self-attention modules and demonstrates adaptability and interpretability.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Ze Liu, Cai Chen, Yuanxun Zhou, Lanting Zhang, Hong Wang
Summary: This study attempts to address the gap in cooling rates between thin film deposition and bulk metallic glass (BMG) casting by correlating the glass-forming range (GFR) determined from combinatorial materials chips (CMCs) with the glass-forming ability (GFA) of BMG. The results show that the full-width at half maximum (FWHM) of the first sharp diffraction peak (FSDP) is a good indicator of BMG GFA, and strong positive correlations between FWHM and the critical casting diameter (Dmax) are observed in various BMG systems. Furthermore, the Pearson correlation coefficients suggest possible similarities in the GFA natures of certain BMG pairs.
SCRIPTA MATERIALIA
(2024)
Article
Nanoscience & Nanotechnology
Mike Schneider, Jean-Philippe Couzinie, Amin Shalabi, Farhad Ibrahimkhel, Alberto Ferrari, Fritz Koermann, Guillaume Laplanche
Summary: This work aims to predict the microstructure of recrystallized medium and high-entropy alloys, particularly the density and thickness of annealing twins. Through experiments and simulations, a database is provided for twin boundary engineering in alloy development. The results also support existing theories and empirical relationships.
SCRIPTA MATERIALIA
(2024)
