Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress
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Title
Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress
Authors
Keywords
Tin, whiskering, thermal cycling, stress relaxation, grain boundary diffusion
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 45, Issue 1, Pages 21-29
Publisher
Springer Nature
Online
2015-08-28
DOI
10.1007/s11664-015-3965-4
References
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