Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress

Kinetics of Sn whisker nucleation using thermally induced stress

(2014) F. Pei et al.   SCRIPTA MATERIALIA

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

(2013) P. Sarobol et al.   ACTA MATERIALIA

In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers

(2013) Fei Pei et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation

(2013) Pylin Sarobol et al.   JOURNAL OF MATERIALS RESEARCH

Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms

(2013) Eric Chason et al.   PROGRESS IN SURFACE SCIENCE

Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization

(2012) Fei Pei et al.   APPLIED PHYSICS LETTERS

Mechanisms of Sn Hillock Growth in Vacuum by In Situ Nanoindentation in a Scanning Electron Microscope (SEM)

(2012) J.J. Williams et al.   JOURNAL OF ELECTRONIC MATERIALS

Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

(2012) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Crystal Orientation on Mechanically Induced Sn Whiskers on Sn-Cu Plating

(2012) Yukiko Mizuguchi et al.   JOURNAL OF ELECTRONIC MATERIALS

A kinetic analysis of residual stress evolution in polycrystalline thin films

(2012) Eric Chason   THIN SOLID FILMS

Sn whisker growth during thermal cycling

(2011) Katsuaki Suganuma et al.   ACTA MATERIALIA

Controlled positions and kinetic analysis of spontaneous tin whisker growth

(2011) Chien-Hao Su et al.   APPLIED PHYSICS LETTERS

Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and Microstructure

(2011) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

High Lateral Resolution Auger Electron Spectroscopic (AES) Measurements for Sn Whiskers on Brass

(2010) Michael J. Bozack et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection

(2010) H.L. Reynolds et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

(2009) M.A. Dudek et al.   ACTA MATERIALIA

A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion

(2009) Eric J. Buchovecky et al.   APPLIED PHYSICS LETTERS

Local, submicron, strain gradients as the cause of Sn whisker growth

(2009) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound

(2009) Eric Buchovecky et al.   JOURNAL OF ELECTRONIC MATERIALS

Stress behavior of electroplated Sn films during thermal cycling

(2009) Jae Wook Shin et al.   JOURNAL OF MATERIALS RESEARCH

Mechanism of Generation and Suppression of Tin Whiskers on Tin and Tin-Lead Plated Films

(2009) Koji Murakami et al.   MATERIALS TRANSACTIONS

Driving force for Sn whisker growth in the system Cu–Sn

(2008) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS

Indentation-induced tin whiskers on electroplated tin coatings

(2008) Fuqian Yang et al.   JOURNAL OF APPLIED PHYSICS

Plastic deformation processes in Cu/Sn bimetallic films

(2008) K.S. Kumar et al.   JOURNAL OF MATERIALS RESEARCH

Pressure-induced tin whisker formation

(2008) Tadahiro Shibutani et al.   MICROELECTRONICS RELIABILITY

Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling

(2008) Yoshikuni Nakadaira et al.   MICROELECTRONICS RELIABILITY