In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers

Published 2013 View Full Article

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Title
In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers
Authors
Keywords
Pb-free manufacturing, tin whiskers, thermal cycling, reliability
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 43, Issue 1, Pages 80-87
Publisher
Springer Nature
Online
2013-11-19
DOI
10.1007/s11664-013-2878-3
References
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