Correlating whisker growth and grain structure on Sn-Cu samples by real-time scanning electron microscopy and backscattering diffraction characterization

Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation

(2010) Nitin Jadhav et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

(2010) Pylin Sarobol et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Nanoindentation of rare earth–Sn intermetallics in Pb-free solders

(2010) M.A. Dudek et al.   INTERMETALLICS

Real-time SEM/FIB studies of whisker growth and surface modification

(2010) Nitin Jadhav et al.   JOM

Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

(2009) M.A. Dudek et al.   ACTA MATERIALIA

Local, submicron, strain gradients as the cause of Sn whisker growth

(2009) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model

(2009) P. T. Vianco et al.   JOURNAL OF ELECTRONIC MATERIALS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS