Article
Materials Science, Multidisciplinary
Zhihua Tian, Peigen Zhang, Yan Zhang, Jingwen Tang, Yushuang Liu, Jian Liu, ZhengMing Sun
Summary: This research investigates the growth of tin whiskers from a Ti6Sn5 intermetallic and finds that they share similar characteristics with whiskers found on platings or solder joints, but they grow more and faster with finer diameters. The study analyzes the growth mechanism using experimental and computational methods, proposing a diffusion-based growth model. It reveals the critical role of the intermetallic substrate in the whiskering phenomenon and provides new insights for comprehensive understanding of whisker growth mechanisms. Additionally, the abundant and rapid growth of tin whiskers also offers a new method for preparing one-dimensional metallic materials.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
(2022)
Article
Chemistry, Physical
Bita Pourbahari, Joseph R. McDermid
Summary: The kinetics of Sb surface segregation were studied in Fe-(0.01/0.03)Sb and Fe-2Mn-(0.01/0.03)Sb at.% alloys using the modified Darken model and linear heating followed by isothermal annealing. Increasing temperatures and isothermal holding times resulted in an increase in Sb surface segregation. Sb segregation was observed at the surface for both Fe-xSb and Fe-2Mn-xSb alloys after annealing. The rate of Sb surface diffusion was faster in Fe-Sb alloys compared to Fe-2Mn-Sb alloys, attributed to differences in crystal structure and defect density in the matrix. The activation energy for Sb diffusion in both Fe-Sb and Fe-2Mn-xSb alloys was determined to be approximately 193 +/- 18 kJ/mol, similar to the activation energy of bulk Sb diffusion in alpha-Fe.
SURFACES AND INTERFACES
(2023)
Article
Materials Science, Multidisciplinary
Shuang Tian, Yushuang Liu, Peigen Zhang, Jian Zhou, Feng Xue, ZhengMing Sun
Summary: This study aimed to understand the features of Sn grains and their effect on the preferential growth of whiskers. By analyzing the compressive stress, orientation relationship, and dislocation behavior, the mechanism of Sn whisker growth was revealed. The findings provide insights into the factors influencing the growth of Sn whiskers on alloy coatings.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
(2021)
Article
Materials Science, Multidisciplinary
Scott B. Donald, Brandon W. Chung
Summary: By using FIB-SEM and 3D microscopy to characterize the morphological features of oxide scales, the study found variations in the oxide surface under different environmental conditions. The oxide scale retained its original structure and chemical characteristics after exposure to dry air environments, but became thinner and without internal microcracking after exposure to moist air environments.
JOURNAL OF NUCLEAR MATERIALS
(2021)
Article
Materials Science, Multidisciplinary
Scott B. Donald, Brandon W. Chung
Summary: In this study, FIB-SEM and 3D microscopy techniques were used to characterize the morphological features of oxide scales formed on Ga plutonium metal alloy. The thickness and morphology of the oxide scale varied greatly, and the oxide layer formed in a moist environment exhibited significant porosity and cracking.
JOURNAL OF NUCLEAR MATERIALS
(2022)
Article
Chemistry, Physical
Lenka Kuncicka, Michal Jambor, Adam Weiser, Jiri Dvorak
Summary: This study focuses on the detailed characterization of the structure and plastic flow of Cu-Zn-Pb brass fittings. The cracking was most likely induced by differences in chemical composition, with local changes in the crack location and an increase in microhardness contributing to local brittleness.
Article
Nanoscience & Nanotechnology
Elif Bilgilisoy, Jo-Chi Yu, Christian Preischl, Lisa McElwee-White, Hans-Peter Steinrueck, Hubertus Marbach
Summary: The precise deposition of nanoscaled structures is crucial for nanomaterial applications. This study successfully fabricated clean and well-defined Ru nanomaterials using highly focused electron beam-induced deposition. The study found that the deposition process competed with the electron-induced etching, resulting in lower Ru content initially. However, with increasing electron doses, the Ru content increased and the etching process became less pronounced. This research expands the possibilities of engineering nanostructured materials.
ACS APPLIED NANO MATERIALS
(2022)
Article
Engineering, Electrical & Electronic
Nupur Jain, Xincheng Wang, Piyush Jagtap, Allan Bower, Eric Chason
Summary: The recent publication describes real-time observations of stress-driven whisker nucleation and growth in a thin film of Sn subjected to pressure, with the model predictions closely matching experimental measurements. The study establishes a threshold stress for whisker growth, which increases with whisker length before reaching a saturated value. Implications for whisker growth in Sn films on Cu substrates are discussed.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Engineering, Manufacturing
Kirstin Riener, Steffen Oswald, Michael Winkler, Gerhard J. Leichtfried
Summary: The study investigated the influence of storage conditions of AlSi10Mg powder on LPBF parts, finding that powder stored under humid conditions led to lower part density and mechanical strength. Drying the powder in a vacuum drying oven can reverse this deterioration in processability.
ADDITIVE MANUFACTURING
(2021)
Article
Biochemistry & Molecular Biology
Monika Kula-Maximenko, Kamil Jan Zielinski, Joanna Depciuch, Janusz Lekki, Marcin Niemiec, Ireneusz Slesak
Summary: In this study, the SOD activity in Synechocystis sp. PCC 6803, Gloeobacter violaceus CCALA 979, and Geitlerinema sp. ZHR1A was analyzed using selective spectroscopic techniques. The results showed the presence of different forms of FeSOD in these cyanobacteria, while no active Cu/ZnSOD was identified. This study has important implications for understanding the activity and evolution of SOD in cyanobacteria.
INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES
(2022)
Article
Nanoscience & Nanotechnology
Ke Lin, Anmin Hu, Yunwen Wu, Huiqin Ling, Tao Hang, Liming Gao, Ming Li
Summary: A novel model was established to calculate the growth rate of whisker on fine-pitch Cu pillar micro-bumps and illustrate its morphology mechanism. The calculated theoretical steady-state average growth rate of whisker on micro-bumps was more accurate than previous models. The diversification of whisker morphology was dependent on various factors. These findings are significantly important for improving the reliability of advanced packaging.
SCRIPTA MATERIALIA
(2022)
Article
Engineering, Electrical & Electronic
Yushuang Liu, Chengjie Lu, Yan Zhang, Shuai Li, Peigen Zhang, Zhengming Sun
Summary: The research found that tin whisker growth propensity increases at higher temperatures or in an oxidizing atmosphere, and whisker nucleation can be accelerated at elevated temperatures. Furthermore, whiskers formed in argon gradually evolve into a faceted morphology driven by the reduction of surface energy. These findings provide valuable insights into tin whisker growth.
JOURNAL OF ELECTRONIC MATERIALS
(2021)
Article
Engineering, Mechanical
Xuankai Wang, Yi Xie, Chao Feng, Zhimin Ding, Dengke Li, Xiaobao Zhou, Tangqing Wu
Summary: By comparing the microstructure and atmospheric corrosion of tin coatings on H62 brass and T2 copper, it was found that the tin coating on brass had more inclusions and higher local corrosion sensitivity. The local corrosion sensitivity and R value of the tin coatings on both copper and brass were higher on the skyward surface than on the earthward surface. The preferential corrosion of (101) oriented crystal particles was the main reason for the higher corrosion sensitivity of the tin coatings, and preferential wetting, suspended particles, and rainwater scouring also influenced the corrosion process of the tin coating.
ENGINEERING FAILURE ANALYSIS
(2022)
Article
Materials Science, Multidisciplinary
Long Zhang, Dengjie Xiong, Junfeng Li, Limeng Yin, Zongxiang Yao, Gang Wang, Liping Zhang, Hehe Zhang
Summary: The study utilized a modified embedded atomic potential to simulate the growth of tin whiskers under electrothermal coupling. It was found that increasing electric field intensity and temperature can promote the diffusion of copper atoms to tin atoms, forming intermetallic compounds and accelerating the growth of tin whiskers.
COMPUTATIONAL MATERIALS SCIENCE
(2022)
Article
Materials Science, Multidisciplinary
F. Bonetto, C. Silva, E. H. Martins Ferreira, A. Candia, M. C. G. Passeggi, S. Montoro, R. Vidal
Summary: Electron beam induced deposition using ethylene as precursor gas is utilized to produce carbonaceous films on Cu (111). The study investigates two different precursor gas pressures and two substrate temperatures, finding that lower substrate temperature and higher ethylene pressure lead to optimal film growth conditions. Additionally, ex-situ techniques such as Raman spectroscopy and scanning tunneling spectroscopy show that the film consists of small nanocrystals of few layers graphene.