Selective metallization of alumina ceramics by inkjet printing combined with electroless copper plating

Metallization of Al 2 O 3 ceramic by magnetron sputtering Ti/Mo bilayer thin films for robust brazing to Kovar alloy

(2016) Chenglai Xin et al.   CERAMICS INTERNATIONAL

Toward Efficient Multi-Keyword Fuzzy Search Over Encrypted Outsourced Data With Accuracy Improvement

(2016) Zhangjie Fu et al.   IEEE Transactions on Information Forensics and Security

The preparation of pH-sensitive Pd catalyst ink for selective electroless deposition of copper on a flexible PET substrate

(2016) Po-Chiang Wang et al.   Journal of the Taiwan Institute of Chemical Engineers

Fabrication of dual-side metal patterns onto textile substrates for wearable electronics by combining wax-dot printing with electroless plating

(2016) H. Zhao et al.   Journal of Materials Chemistry C

A rapid learning algorithm for vehicle classification

(2015) Xuezhi Wen et al.   INFORMATION SCIENCES

Electroless Copper Plating of Inkjet-Printed Polydopamine Nanoparticles: a Facile Method to Fabricate Highly Conductive Patterns at Near Room Temperature

(2014) Siyuan Ma et al.   ACS Applied Materials & Interfaces

Fabrication of Copper Patterns on Flexible Substrate by Patterning–Adsorption–Plating Process

(2014) Yu Chang et al.   ACS Applied Materials & Interfaces

Inkjet Printing of Conductive Inks with High Lateral Resolution on Omniphobic “RFPaper” for Paper-Based Electronics and MEMS

(2014) Joshua Lessing et al.   ADVANCED MATERIALS

Surface metallization of alumina ceramics: Effects of sintering time and substrate etching

(2014) Zhiqin Zheng et al.   CERAMICS INTERNATIONAL

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

(2014) Shao-Ping Shen et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Microwave integrated circuits fabrication on alumina substrate using pattern up direct electroless nickel and immersion Au plating and study of its properties

(2013) R.K. Sharma et al.   MICROELECTRONIC ENGINEERING

Fabrication of flexible copper-based electronics with high-resolution and high-conductivity on paper via inkjet printing

(2013) Tengyuan Zhang et al.   Journal of Materials Chemistry C

Microstructure–thermal properties of Cu/Al2O3 bilayer prepared by direct bonding

(2012) Shao-Kuan Lee et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Formulation and screen printing of water based conductive flake silver pastes onto green ceramic tapes for electronic applications

(2012) Rita Faddoul et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates

(2011) Alexandre Garcia et al.   ADVANCED FUNCTIONAL MATERIALS

Inkjet printing of single-crystal films

(2011) Hiromi Minemawari et al.   NATURE

Study of a pre-treatment process for electroless copper plating on ceramics

(2011) Hongfang Ma et al.   THIN SOLID FILMS

Three-Dimensional Printing of Interconnects by Laser Direct-Write of Silver Nanopastes

(2010) Jiwen Wang et al.   ADVANCED MATERIALS

Selective Electroless Copper Plating on Poly(ethylene terephthalate) Surfaces by Microcontact Printing

(2010) Shih-Chun Huang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Fabrication of uniform Ag/TiO2 nanotube array structures with enhanced photoelectrochemical performance

(2010) Yuekun Lai et al.   NEW JOURNAL OF CHEMISTRY

Selective Electroless Metallization of Patterned Polymeric Films for Lithography Applications

(2009) Daniel Zabetakis et al.   ACS Applied Materials & Interfaces

Inkjet Printing-Process and Its Applications

(2009) Madhusudan Singh et al.   ADVANCED MATERIALS

Joining of engineering ceramics

(2009) J A Fernie et al.   INTERNATIONAL MATERIALS REVIEWS

Influence of Fluid Physical Properties on Ink-Jet Printability

(2009) Daehwan Jang et al.   LANGMUIR