Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates

Title
Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates
Authors
Keywords
-
Journal
ADVANCED FUNCTIONAL MATERIALS
Volume 21, Issue 11, Pages 2096-2102
Publisher
Wiley
Online
2011-04-12
DOI
10.1002/adfm.201100041

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