Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates
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Title
Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates
Authors
Keywords
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Journal
ADVANCED FUNCTIONAL MATERIALS
Volume 21, Issue 11, Pages 2096-2102
Publisher
Wiley
Online
2011-04-12
DOI
10.1002/adfm.201100041
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