Article
Materials Science, Multidisciplinary
Xing Dang, Kaifang Cui, Jing Zhuang, Liang Zhong, Yunfei He, Guoqiang Li, Guang Du, Zhigang Yang, Sifeng Pei, Siqi Li
Summary: A new non-destructive activation process was developed to attach nickel nanoparticles firmly to the surface of alumina ceramics for electroless nickel plating. The process reduced the use of corrosive drugs and noble metals, and was environmentally friendly. The parameters of the activation process were optimized, and characterization techniques were used to analyze the coating quality. The process showed advantages of simplicity, low cost, and non-destructiveness.
MATERIALS TODAY COMMUNICATIONS
(2023)
Article
Chemistry, Physical
Pingping Zhang, Zunhang Lv, Xuguang Liu, Guangwen Xie, Baoquan Zhang
Summary: A cost-effective metallic nickel activation process is proposed for porous alumina ceramic, leading to excellent electrocatalytic oxygen evolution performance. This is attributed to its amorphous structure and the presence of oxides and hydroxides on its surface, providing catalytic active sites for oxygen evolution reaction. Thus, the simple metallic nickel activation process shows promise for electroless nickel plating on porous alumina ceramic.
CATALYSIS COMMUNICATIONS
(2021)
Article
Chemistry, Physical
Yiru Li, Wen Zheng, Aibo Zhang, Zhiyuan Xie, Moxi Liu
Summary: This study demonstrated the preparation of silver microspheres with controllable morphology and structure for constructing absorbing hybrids. Results revealed that activation and plating solution concentration played crucial roles in enhancing the microwave absorbing performances of the hybrids.
JOURNAL OF ALLOYS AND COMPOUNDS
(2021)
Article
Materials Science, Ceramics
Seung Ho Han, Bo-Young Kim, Jae Kwang Lee, Intae Seo, Hyung-Won Kang, Myong Jae Yoo
Summary: A simple and economical method was developed for the selective metallization of piezoelectric ceramics, achieving high-adhesion copper patterns on the ceramics through laser-induced surface modification and electroless copper plating. The results were comparable to those of screen-printed silver electrodes.
CERAMICS INTERNATIONAL
(2022)
Article
Chemistry, Physical
Yabing Zhang, Teng Zhang, Hongbin Shi, Qing Liu, Tao Wang
Summary: Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive PET substrate by combining inkjet print with Cu NPs conductive ink and ELP copper. The patterns exhibited low resistivity, excellent anti-oxidation performance, and remained adhered to the substrate even after 4000 cycles bending test.
APPLIED SURFACE SCIENCE
(2021)
Article
Materials Science, Paper & Wood
Guangming Sun, Jintian Huang, Shufen Hao, Qian Zhang
Summary: In this study, a simple, efficient, and low-cost process was introduced to create a lightweight and green microwave absorber, TOMCC/AgNPs, by mixing silver nanoparticles (AgNPs) with TEMPO-oxidized microcrystalline cellulose (TOMCC) through electroless plating. The physicochemical properties and surface morphology of TOMCC/AgNPs were characterized using various analytical techniques, and the electromagnetic absorption of the fabricated material was analyzed. The results showed that TOMCC/AgNPs exhibited excellent microwave absorption performance, with an optimal reflection loss value of -51 dB at 4.7 GHz and a wide effective absorption bandwidth of 4 GHz, even at high temperatures.
Article
Computer Science, Information Systems
Ran Zhang, Qinyi Wang, Ya Chen, Chen Jiao, Fuxi Liu, Junwei Xu, Qiuwei Zhang, Jiantao Zhao, Lida Shen, Changjiang Wang
Summary: In this study, dicopper hydroxide phosphate was added to resin to prepare resin sheets. The copper base points on the resin surface were activated by laser and silver electrodes on the detection chips effectively distinguished glucose solutions of different concentrations. A novel detection kit with a three-electrode chip was designed for future rapid health testing.
Article
Green & Sustainable Science & Technology
Seonyeop Kim, Inhwan Lee, Hochan Kim
Summary: A novel method for fabricating PCB-free parts with electronic circuits in a product's casing or exterior is proposed in this study. By directly forming conductive circuits on 3D-printed substrates, the need for traditional molding technologies is eliminated. The results demonstrate good practical applicability of the proposed process, with low environmental toxicity.
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING-GREEN TECHNOLOGY
(2021)
Article
Engineering, Electrical & Electronic
Liang Tian, Chang Lin, Kui Pan, Yu Lu, Liying Deng, Zhonghang Huang, Tianxi Yang, Yongai Zhang, Jie Sun, Qun Yan
Summary: This article introduces a method of preparing metallic bumps with an ultrafine pitch using electroless plating, and cheap metals iron and nickel are selected as catalysts. The research results show that uniform and consistent bumps can be obtained through the iron sheet and nickel layer method, and there are no voids or impurities inside the bumps.
ACS APPLIED ELECTRONIC MATERIALS
(2022)
Article
Nanoscience & Nanotechnology
Ji Li, Yan Zhang, Peiren Wang, Guoqi Wang, Yifei Liu, Yaning Liu, Qianshuai Li
Summary: Direct manufacturing of customized end-use electronic products through additive manufacturing is a growing trend. A novel hybrid additive manufacturing solution that combines traditional AM processes with SLA 3D printing and laser-activated electroless plating has been proposed, enabling the creation of 3D fully functional electronic products with high-resolution circuitry and high-performance electrical materials.
ACS APPLIED MATERIALS & INTERFACES
(2021)
Article
Materials Science, Multidisciplinary
Mohammadhassan Badihehaghdam, Seyyed Mohammad Mousavi Khoie, Farzaneh Khast, Mobin Safarzadeh Khosrowshahi
Summary: The incorporation of AlN nanoparticles into Ni-P matrix significantly enhances the hardness, wear resistance, and corrosion resistance of the composite coating. Heat treatment further improves the chemical and mechanical properties of the coatings.
METALS AND MATERIALS INTERNATIONAL
(2022)
Article
Materials Science, Coatings & Films
Giulia Pedrizzetti, Laura Paglia, Virgilio Genova, Serena Cinotti, Michelangelo Bellacci, Francesco Marra, Giovanni Pulci
Summary: This study aims to develop Ni-P-ZrO2 nanocomposites and study their effect on microhardness and corrosion resistance. The introduction of nanoparticles does not affect the microstructure, but significantly influences the distribution of the nanocomposites. Faster growth leads to agglomeration of nanoparticles and non-uniform microhardness. Effective dispersion strengthens the microhardness and corrosion resistance.
SURFACE & COATINGS TECHNOLOGY
(2023)
Article
Materials Science, Textiles
Mingliu Li, Bingzheng Song, Lifang Su, Zhendong Jin, Zaisheng Cai, Yaping Zhao
Summary: A novel palladium-free and environmentally friendly surface activation process was applied to prepare nickel plated fabric, demonstrating promising potential for electromagnetic shielding materials. By using nickel salt as an activator instead of metallic palladium, this approach achieves palladium-free activation and exhibits good electromagnetic shielding effectiveness.
FIBERS AND POLYMERS
(2021)
Letter
Chemistry, Physical
P. S. Shih, C. H. Huang, C. R. Kao
Summary: High-density Cu nanotwins in columnar grains were successfully fabricated using a formaldehyde-based electroless plating solution. Additives induced the crystallization of the nanotwinned structure, and the deposited Cu nanotwins had a high percentage of (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process make this method promising for future applications in the electronics industry.
JOURNAL OF ALLOYS AND COMPOUNDS
(2023)
Article
Chemistry, Physical
Dongxu Huang, Mingqi Huang, Deliang Sun, Bincan Liu, Rui Xuan, Jinshan Liu, Rong Sun, Jinhui Li, Guoping Zhang, Daquan Yu
Summary: This study successfully improved the adhesion strength between copper and glass by preparing ZnO coating on the glass surface, achieving a high adhesion strength of up to 5B. Furthermore, a specific chemical was used to create an optional hydrophobic surface, allowing for selective electroless copper plating patterns.
COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
(2021)
