Single-crystal-like GdNdOx thin films on silicon substrates by magnetron sputtering and high-temperature annealing for crystal seed layer application

Performance and Reliability of ${\rm Gd}_{2}{\rm O}_{3}$ and Stacked ${\rm Gd}_{2}{\rm O}_{3}\hbox{-}{\rm Eu}_{2}{\rm O}_{3}$ Metal-Insulator-Metal Capacitors

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High-Performance Metal–Insulator–Metal Capacitors Using Europium Oxide as Dielectric

(2012) Revathy Padmanabhan et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

High-Performance $\hbox{Ni}/\hbox{Lu}_{2}\hbox{O}_{3}/ \hbox{TaN}$ Metal–Insulator–Metal Capacitors

(2011) Somnath Mondal et al.   IEEE ELECTRON DEVICE LETTERS

High-Density MIM Capacitors With Porous Anodic Alumina Dielectric

(2010) E. Hourdakis et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Preparation and characterization of TaAlOx high-κ dielectric for metal–insulator–metal capacitor applications

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Characteristics of Cerium Oxide for Metal–Insulator–Metal Capacitors

(2009) C. H. Cheng et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Physical and Electrical Characterization of Metal–Insulator–Metal Capacitors With $\hbox{Sm}_{2}\hbox{O}_{3}$ and $\hbox{Sm}_{2}\hbox{O}_{3}/\hbox{SiO}_{2}$ Laminated Dielectrics for Analog Circuit Applications

(2009) Jing-De Chen et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

High performance TaYOx-based MIM capacitors

(2009) C. Mahata et al.   MICROELECTRONIC ENGINEERING

High Density and Low Leakage Current in $ \hbox{TiO}_{2}$ MIM Capacitors Processed at 300 $^{\circ} \hbox{C}$

(2008) C. H. Cheng et al.   IEEE ELECTRON DEVICE LETTERS