High power InGaN/GaN flip-chip LEDs with via-hole-based two-level metallization electrodes
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Title
High power InGaN/GaN flip-chip LEDs with via-hole-based two-level metallization electrodes
Authors
Keywords
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Journal
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
Volume 213, Issue 12, Pages 3150-3156
Publisher
Wiley
Online
2016-08-03
DOI
10.1002/pssa.201600319
References
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