Airgaps in nano-interconnects: Mechanics and impact on electromigration

Stress analysis of airgaps under process-induced thermo-mechanical loads

(2016) Houman Zahedmanesh et al.   MICROELECTRONIC ENGINEERING

A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes

(2016) Houman Zahedmanesh et al.   MICROELECTRONIC ENGINEERING

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation

(2016) Houman Zahedmanesh et al.   MICROELECTRONICS RELIABILITY

Effect of Pore Structure of Nanometer Scale Porous Films on the Measured Elastic Modulus

(2013) Kris Vanstreels et al.   LANGMUIR

Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes

(2013) V. Kumaresan et al.   MICROELECTRONIC ENGINEERING

Electromigration failure in a copper dual-damascene structure with a through silicon via

(2012) R.L. de Orio et al.   MICROELECTRONICS RELIABILITY

Manipulating stress in Cu/low-k dielectric nanocomposites

(2011) Conal E. Murray et al.   APPLIED PHYSICS LETTERS

Triaxial stress distributions in Cu/low-k interconnect features

(2011) Conal E. Murray et al.   APPLIED PHYSICS LETTERS

In situ evolution of stress gradients in Cu films induced by capping layers

(2010) Conal E. Murray et al.   APPLIED PHYSICS LETTERS

An investigation of electromigration induced void nucleation time statistics in short copper interconnects

(2010) V. M. Dwyer   JOURNAL OF APPLIED PHYSICS

Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction

(2009) C. J. Wilson et al.   APPLIED PHYSICS LETTERS

Synchrotron measurement of the effect of linewidth scaling on stress in advanced Cu/Low-k interconnects

(2009) Christopher J. Wilson et al.   JOURNAL OF APPLIED PHYSICS

Electromigration-induced extrusion failures in Cu/low-k interconnects

(2008) Frank L. Wei et al.   JOURNAL OF APPLIED PHYSICS