Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation

Published 2016 View Full Article

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Title
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation
Authors
Keywords
Airgap design, Ultra low-k dielectric (ULK), Interconnect, Finite element model (FEM), Capacitance
Journal
MICROELECTRONICS RELIABILITY
Volume 59, Issue -, Pages 102-107
Publisher
Elsevier BV
Online
2016-02-01
DOI
10.1016/j.microrel.2016.01.015

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