Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction

Published 2009 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction
Authors
Keywords
-
Journal
APPLIED PHYSICS LETTERS
Volume 94, Issue 18, Pages 181914
Publisher
AIP Publishing
Online
2009-05-09
DOI
10.1063/1.3133345
References
View 1 related references

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.