Influence of fixed abrasive configuration on the polishing process of silicon wafers
Published 2016 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Influence of fixed abrasive configuration on the polishing process of silicon wafers
Authors
Keywords
Wafer polishing, Abrasive configuration, Trajectory, Uniformity, Roughness
Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume 88, Issue 1-4, Pages 575-584
Publisher
Springer Nature
Online
2016-04-26
DOI
10.1007/s00170-016-8808-9
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Kinematics and trajectory of both-sides cylindrical lapping process in planetary motion type
- (2015) Julong Yuan et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing
- (2014) N. Y. Nguyen et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Study on removal mechanism and removal characters for SiC and fused silica by fixed abrasive diamond pellets
- (2014) Zhichao Dong et al. INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
- Kinematic Optimization for Chemical Mechanical Polishing Based On Statistical Analysis of Particle Trajectories
- (2013) Dewen Zhao et al. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
- Design optimization of diamond disk pad conditioners
- (2012) Emmanuel A. Baisie et al. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
- Influence of kinematics and abrasive configuration on the grinding process of glass
- (2012) F.J.P. Sousa et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- A CMP Model Including Global Distribution of Pressure
- (2011) Sascha Bott et al. IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
- Relationships between Contact Image Analysis Results for Pad Surface Texture and Removal Rate in CMP
- (2011) Michio Uneda et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- An investigation of the effects of the tool path on the removal of material in polishing
- (2010) Hon-yuen Tam et al. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
- Impact of Pad–Wafer Contact Area in Chemical Mechanical Polishing
- (2009) Suresh B. Yeruva et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- A Material Removal Model for CMP Based on the Contact Mechanics of Pad, Abrasives, and Wafer
- (2009) Dinçer Bozkaya et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Basic research on polishing with ice bonded nanoabrasive pad
- (2009) Dunwen Zuo et al. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
- Modeling of chemical–mechanical polishing considering thermal coupling effects
- (2008) Seunghee Oh et al. MICROELECTRONIC ENGINEERING
- Effects of kinematic forms on material removal rate and non-uniformity in chemical mechanical planarisation
- (2007) C.L. Wang et al. INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY
Create your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create NowAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started