Modeling of chemical–mechanical polishing considering thermal coupling effects

Published 2008 View Full Article

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Title
Modeling of chemical–mechanical polishing considering thermal coupling effects
Authors
Keywords
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Journal
MICROELECTRONIC ENGINEERING
Volume 85, Issue 11, Pages 2191-2201
Publisher
Elsevier BV
Online
2008-05-05
DOI
10.1016/j.mee.2008.04.037

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