标题
Influence of fixed abrasive configuration on the polishing process of silicon wafers
作者
关键词
Wafer polishing, Abrasive configuration, Trajectory, Uniformity, Roughness
出版物
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume 88, Issue 1-4, Pages 575-584
出版商
Springer Nature
发表日期
2016-04-26
DOI
10.1007/s00170-016-8808-9
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Kinematics and trajectory of both-sides cylindrical lapping process in planetary motion type
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