A CMP Model Including Global Distribution of Pressure

Published 2011 View Full Article

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Title
A CMP Model Including Global Distribution of Pressure
Authors
Keywords
-
Journal
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
Volume 24, Issue 2, Pages 304-314
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2011-01-22
DOI
10.1109/tsm.2011.2107532

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