Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics

Published 2020 View Full Article

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Title
Material removal and wear mechanism in abrasive polishing of SiO2/SiC using molecular dynamics
Authors
Keywords
Molecular dynamics, Silicon carbide, Silicon dioxide, Wear regime, Sliding, Rolling
Journal
CERAMICS INTERNATIONAL
Volume -, Issue -, Pages -
Publisher
Elsevier BV
Online
2020-05-31
DOI
10.1016/j.ceramint.2020.05.263

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