Article
Computer Science, Interdisciplinary Applications
Galip Orkun Arican, Ozlem Sen, Gonul Turhan-Sayan
Summary: This article presents the design and measurement results of a novel compact branch-line coupler (BLC) for X-band monolithic microwave integrated circuit (MMIC) applications. The proposed BLC utilizes T- and pi-type equivalent transmission line approaches and meandering technique to significantly reduce the size of the conventional BLC. The manufactured BLC demonstrates good performance with a wide bandwidth and small size.
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING
(2022)
Article
Chemistry, Analytical
Hai Dong, Yingtao Ding, Han Wang, Xingling Pan, Mingrui Zhou, Ziyue Zhang
Summary: Three-dimensional integration based on through-silicon-via (TSV) technology is used to miniaturize electronic systems. In this paper, novel integrated passive devices (IPDs) including capacitor, inductor, and bandpass filter are designed using TSV structures. The TSV-based capacitor and inductor's electrical performance is evaluated by considering the TSV structural parameters. Additionally, a third-order Butterworth bandpass filter with a central frequency of 2.4 GHz is developed using the topologies of capacitor and inductor elements, demonstrating good RF performance with low cost and simple architecture.
Article
Computer Science, Information Systems
Zhibo Zhao, Jinkai Li, Haoyun Yuan, Zeyu Wang, Giovanni Gugliandolo, Nicola Donato, Giovanni Crupi, Liming Si, Xiue Bao
Summary: TSV-based coaxial line techniques can improve the efficiency of vertical signal transmission and achieve excellent electrical performance in RF/microwave systems. However, obtaining ideal coaxial TSVs is challenging due to material limitations and manufacturing difficulties. This paper proposes modeling and analysis theories to enhance the flexibility of designing and manufacturing TSV structures.
Article
Engineering, Electrical & Electronic
R. A. Coppeta, M. Pusterhofer, W. Zisser, G. Kravchenko
Summary: This study compares the results of a finite element analysis on the strain gradients around a through-silicon via (TSV) in a silicon sample with available measurements. The simulation results align well with the measured data for the radial and axial normal components, but a considerable discrepancy is found in the values of the tangential normal component. The influence of residual stresses between the TSV and the silicon sample is evaluated, which causes significant deformation and strain gradient near the TSV.
MICROELECTRONICS RELIABILITY
(2022)
Review
Engineering, Electrical & Electronic
Haoming Guo, Shengbin Cao, Lei Li, Xiaofeng Zhang
Summary: This review provides a comprehensive summary of four mainstream TSV etching methods, including KOH wet etching, laser drilling, deep reactive ion etching, and photo-assisted electrochemical etching. It covers their etching mechanism, process, parameters, and hole structure, aiming to offer researchers and engineers an updated understanding of these methods.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
Article
Engineering, Chemical
Muhammad Akmal Chaudhary, Saeed Roshani, Sobhan Roshani
Summary: This paper proposes a branch line coupler with ultra-compact size and harmonic suppression ability using an LCL filter and meandered stubs. The proposed coupler achieves superior size reduction and harmonic suppression by incorporating LCL filters consisting of T-shaped circuits and meandered line open-ended stubs. The coupler operates at 900 MHz with a 300 MHz operating bandwidth and exhibits a wide suppression band from 1.4 GHz to 8.8 GHz, suppressing unwanted harmonics from the second to ninth order. Its overall size is only 3% of the conventional coupler, corresponding to a 97% size reduction. Experimental results validate the performance improvement and size reduction potential of the proposed technique for similar couplers.
Article
Computer Science, Hardware & Architecture
Wei Xiong, Gang Dong, Changle Zhi, Yang Wang, Zhangming Zhu, Yintang Yang
Summary: This article proposes a design strategy using TSV insertion and Neuro-TF modeling to achieve miniaturization of coupled-line couplers. A design flow is proposed to determine the initial parameters of TSV insertion and Neuro-TF modeling is utilized for optimization. The proposed strategy enables rapid design and effective area reduction.
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
(2023)
Article
Engineering, Electrical & Electronic
Qi Zheng, Peng Yang, Haiyun Xue, Huimin He, Rui Cao, Fengwei Dai, Siwei Sun, Fengman Liu, Qidong Wang, Liqiang Cao, Lijun Chen, Xuyan Sun, Peng Sun
Summary: This paper investigates the design and simulation of integrating edge coupler and through silicon vias in a 3D integrated photonic interposer, with good agreement between measured and simulated results. The high-frequency transmission lines show excellent performance, achieving insertion loss less than 0.35 dB @ 67 GHz, and a 56GBaud (112Gbps) eye diagram quality. Additionally, a 3D optical package module based on active optical interposer has been successfully realized.
JOURNAL OF LIGHTWAVE TECHNOLOGY
(2022)
Article
Computer Science, Interdisciplinary Applications
Hongmei Liu, Xiaoting Li, Jiahui Wang, Shaojun Fang, Zhongbao Wang
Summary: This paper presents the synthesis of a miniaturized filtering coupled-line trans-directional coupler with wide suppression band and high frequency selectivity. The design is simple, with a bandwidth of 32% at 1 GHz and more than 10 dB return loss/isolation.
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING
(2021)
Article
Computer Science, Information Systems
Kanaparthi V. Phani Kumar, Abdullah J. Alazemi
Summary: This article presents a flexible miniaturized wideband branch-line coupler printed on a biodegradable paper substrate, which consists of series transmission lines, shunt open-stubs, and meandering technique. The prototype has been tested to have a fractional bandwidth greater than 60% at 0.9 GHz, making it suitable for antenna feeding networks and microwave applications that require compact size and wideband response.
Article
Engineering, Electrical & Electronic
Wei Xiong, Gang Dong, Zhangming Zhu, Yingtang Yang
Summary: This letter proposes a compact and physics based model for TSV-based 3-D inductors, which accurately evaluates the characteristics of TSV-based inductors in a wideband frequency range. The model takes into account various effects in TSVs and RDLs, and has been confirmed to be accurate through experimental and electromagnetic simulation results.
IEEE ELECTRON DEVICE LETTERS
(2021)
Article
Electrochemistry
Youngkeun Jeon, Young Yoon, Myung Jun Kim, Jae Jeong Kim
Summary: The study found that halide ions can facilitate the adsorption of PEG, and different halide ions have varying suppression effects on PEG-halide ion layers, with Br- enabling Cu bottom-up filling. This research highlights the significant role of the suppression layer in Cu bottom-up filling.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
(2021)
Article
Engineering, Electrical & Electronic
Min Zhang, Fei Qin, Si Chen, Yanwei Dai, Pei Chen, Tong An
Summary: This paper investigates the relationship between the second protrusion height of TSV-Cu and its microstructural characteristics during double annealing. It is found that the grain size of TSV-Cu after annealing once is larger, and the second protrusion can be greatly reduced under additional annealing. The reduction is related to microstructure characteristics such as <111> texture and Sigma 3 grain boundary type. Finite element analysis is used to analyze stress and strain, revealing the mechanisms of the reduction in the second protrusion height.
JOURNAL OF ELECTRONIC MATERIALS
(2022)
Article
Computer Science, Information Systems
Rusan Kumar Barik, Slawomir Koziel, Stanislaw Szczepanski
Summary: This paper presents a novel design of a wideband highly-selective bandpass filtering branch-line coupler (FBLC) that achieves excellent selectivity and broad operating bandwidth. The proposed circuit integrates a coupled microstrip line and an open-ended stub at each port of a single-section BLC, and has been verified through EM simulations and physical measurements. Experimental results demonstrate over 71-percent fractional bandwidth (2.25 GHz to 4.74 GHz) with a power imbalance lower than 0.5 dB, along with good return loss, isolation, and phase imbalance.
Article
Computer Science, Interdisciplinary Applications
Yifan Zhang, Yongle Wu, Weimin Wang
Summary: This paper presents a miniaturized filtering trans-directional (TRD) coupler with enhanced input-reflectionless feature. Coupled two-line and three-line sections are loaded to realize the filtering performance. The coupled three-line structure provides a higher coupling factor and wider bandwidth. The input-reflectionless feature is realized by the signal-interference of the reflected stop-band signals of two output ports.
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING
(2022)
