Journal
IEICE ELECTRONICS EXPRESS
Volume 18, Issue 18, Pages -Publisher
IEICE-INST ELECTRONICS INFORMATION COMMUNICATION ENGINEERS
DOI: 10.1587/elex.18.20210319
Keywords
inductor; through-silicon via (TSV); AC inductance; quality factor
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Funding
- National Natural Science Foundation of China [61804112, 61774127]
- Fok Ying Tung Education Foundation [171112]
- Shaanxi Innovation Capacity Support Project [2020KJXX-093]
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The study proposes a formula for the DC inductance of on-chip three-dimensional TSV-based inductors, and analytical models for AC inductance and quality factor considering frequency effects. The fabricated and measured TSV-based inductors show good consistency with the reported results.
Aimed at the emerging on-chip three-dimensional through-silicon vias (TSVs)-based inductor, the formula for the DC inductance is proposed. And then, based on this formula and the equivalent circuit model analytical models of AC inductance and quality factor are proposed considering frequency effect. Finally, the TSV-based inductors are fabricated and measured. It is shown that the reported results match very well with each other.
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