4.6 Article

Miniature Butler Matrix Design Using Glass-Based Thin-Film Integrated Passive Device Technology for 2.5-GHz Applications

Journal

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume 61, Issue 7, Pages 2594-2602

Publisher

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TMTT.2013.2261540

Keywords

Branch-line coupler; Butler matrix; bridged-T coil; integrated passive device (IPD)

Funding

  1. National Science Council of Taiwan, R.O.C. [NSC 99-2221-E-008-096-MY3, NSC 100-2628-E-008-010-MY3]
  2. National Chip Implementation Center, Taiwan, R.O.C.
  3. National Center for High-Performance Computing, Taiwan, R.O.C.

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In this paper, miniature branch-line coupler and Butler matrix designs for 2.5-GHz applications are proposed using the glass-based thin-film integrated passive device (TF-IPD) technology. The size reduction is achieved by replacing the quarter-wavelength transmission lines in a conventional branch-line coupler with the bridged-T coil. In this way, the circuit size can be largely reduced without sacrificing the operation bandwidth. The proposed miniature branch-line coupler is then applied to the design of a 4 x 4 Butler matrix centered at 2.5 GHz using the glass-based TF-IPD technology. The measured results show a bandwidth of 2.4-2.6 GHz for better than 13-dB return loss with a maximal dissipation of 4 dB, amplitude imbalance within 1.1 dB, and phase imbalance less than 13 degrees. Notably, the proposed Butler matrix occupies a chip area of 3.13 mm x 3.3 mm, which is only about 0.026 gimel(0) x 0.027 gimel(0) at 2.5 GHz.

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