Journal
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS
Volume 25, Issue 3, Pages 1164-1167Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TVLSI.2016.2620460
Keywords
Coaxial through-silicon via (TSV); low-pass filter (LPF); S-parameters; spiral inductor
Funding
- National Natural Science Foundation of China [61404105]
- Young Talent Fund of University Association for Science and Technology in Shaanxi, China [20150112]
- Key Discipline Project in Shaanxi Province of China [107000090803]
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Based on through-silicon-via technology, we propose an ultracompact Butterworth low-pass filter (LPF) with area of 0.01 mm(2). An equivalent circuit model of the proposed LPF is exploited, analyzed, and simplified. The comparisons of filtering characteristics among ideal 4-GHz fifth-order Butterworth LPF, equivalent circuit model, and full wave simulation of proposed LPF validate the accuracy of the equivalent circuit model. And the proposed LPF exhibits ultracompact size and superior filtering characteristics compared with the existing LPF.
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