Highly uniform microfluidic electroless interconnections for chip stacking applications

Vertical Interconnections by Electroless Au Deposition on Electroless Ni Immersion Au Surface Finish

(2020) I. A. Weng et al.   JOURNAL OF ELECTRONIC MATERIALS

Materials Merging Mechanism of Microfluidic Electroless Interconnection Process

(2018) S. Yang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

(2018) I.A. Weng et al.   SCRIPTA MATERIALIA

Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating

(2017) H. T. Hung et al.   JOURNAL OF ELECTRONIC MATERIALS

Initiation electroless nickel plating by atomic hydrogen for PCB final finishing

(2016) Jianhui Lin et al.   CHEMICAL ENGINEERING JOURNAL

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu

(2015) Chien-Min Liu et al.   Scientific Reports

Structural design guideline to minimize extreme low-k delamination potential in 40nm flip-chip packages

(2012) Yi-Shao Lai et al.   MICROELECTRONICS RELIABILITY

Copper Electroless Bonding of Dome-Shaped Pillars for Chip-to-Package Interconnect

(2011) Hyo-Chol Koo et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

(2011) C.S. Tan et al.   MICROELECTRONICS RELIABILITY

Affect of Anneal Temperature on All-Copper Flip-Chip Connections Formed via Electroless Copper Deposition

(2011) Hyo-Chol Koo et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol

(2009) C. S. Tan et al.   APPLIED PHYSICS LETTERS

Copper pillar bump design optimization for lead free flip-chip packaging

(2009) K. M. Chen et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization

(2008) Tyler Osborn et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY