Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits

Published 2018 View Full Article

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Title
Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits
Authors
Keywords
Bonding, Interconnections, Electroless plating
Journal
SCRIPTA MATERIALIA
Volume 159, Issue -, Pages 119-122
Publisher
Elsevier BV
Online
2018-09-21
DOI
10.1016/j.scriptamat.2018.09.026

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