Structural design guideline to minimize extreme low-k delamination potential in 40nm flip-chip packages

Published 2012 View Full Article

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Title
Structural design guideline to minimize extreme low-k delamination potential in 40nm flip-chip packages
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 11, Pages 2851-2855
Publisher
Elsevier BV
Online
2012-06-09
DOI
10.1016/j.microrel.2012.05.007

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