All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization

Published 2008 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization
Authors
Keywords
-
Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 155, Issue 4, Pages D308
Publisher
The Electrochemical Society
Online
2008-03-08
DOI
10.1149/1.2839007
References
View 1 related references

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.