Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging
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Title
Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging
Authors
Keywords
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Journal
ACS Applied Materials & Interfaces
Volume 13, Issue 13, Pages 15791-15801
Publisher
American Chemical Society (ACS)
Online
2021-03-24
DOI
10.1021/acsami.0c22434
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