Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging

Electric‐Field‐Assisted Growth of Vertical Graphene Arrays and the Application in Thermal Interface Materials

(2020) Shichen Xu et al.   ADVANCED FUNCTIONAL MATERIALS

Liquid cooling module incorporating a metal foam and fin hybrid structure for high power insulated gate bipolar transistors (IGBTs)

(2020) Jooyoung Lee et al.   APPLIED THERMAL ENGINEERING

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

(2019) Wen Dai et al.   ACS Nano

Graphene related materials for thermal management

(2019) Yifeng Fu et al.   2D Materials

First-principles Modeling of Thermal Transport in Materials: Achievements, Opportunities, and Challenges

(2019) Tengfei Ma et al.   INTERNATIONAL JOURNAL OF THERMOPHYSICS

Bonding technology based on solid porous Ag for large area chips

(2018) Chuantong Chen et al.   SCRIPTA MATERIALIA

Directing lateral growth of lithium dendrites in micro-compartmented anode arrays for safe lithium metal batteries

(2018) Peichao Zou et al.   Nature Communications

Electrochemically enabled manipulation of gallium-based liquid metals within porous copper

(2018) Jin-Lei Ma et al.   Materials Horizons

A Review of Nanoporous Metals in Interconnects

(2018) Kashyap Mohan et al.   JOM

A Brief Review on High-Temperature, Pb-Free Die-Attach Materials

(2018) Hongwen Zhang et al.   JOURNAL OF ELECTRONIC MATERIALS

Reliability Evaluation of Multichip Phase-Leg IGBT Modules Using Pressureless Sintering of Nanosilver Paste by Power Cycling Tests

(2017) Shancan Fu et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Novel nanostructured thermal interface materials: a review

(2017) Josef Hansson et al.   INTERNATIONAL MATERIALS REVIEWS

Present and future thermal interface materials for electronic devices

(2017) Kafil M. Razeeb et al.   INTERNATIONAL MATERIALS REVIEWS

First principles calculation of lattice thermal conductivity of metals considering phonon-phonon and phonon-electron scattering

(2016) Yan Wang et al.   JOURNAL OF APPLIED PHYSICS

Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study

(2016) K. S. Siow et al.   JOURNAL OF ELECTRONIC PACKAGING

Functionalization mediates heat transport in graphene nanoflakes

(2016) Haoxue Han et al.   Nature Communications

Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

(2015) Hyunseok Oh et al.   IEEE TRANSACTIONS ON POWER ELECTRONICS

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

(2015) Yang Liu et al.   MICROELECTRONICS RELIABILITY

Emerging challenges and materials for thermal management of electronics

(2014) Arden L. Moore et al.   Materials Today

Enhanced thermal transport at covalently functionalized carbon nanotube array interfaces

(2014) Sumanjeet Kaur et al.   Nature Communications

Physical, mechanical, thermodynamic and electronic characterization of Cu11In9 crystal using first-principles density functional theory calculation

(2013) Hsien-Chie Cheng et al.   COMPUTATIONAL MATERIALS SCIENCE

Phase Identification of Cu-In Alloys with 45 and 41.25 at.% In Compositions

(2013) L. Baqué et al.   JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION

Reliability of thermal interface materials: A review

(2012) Jens Due et al.   APPLIED THERMAL ENGINEERING

Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation

(2012) Santosh Kumar et al.   Materials Science and Engineering B-Advanced Functional Solid-State Materials

Mechanical properties of nano-silver joints as die attach materials

(2011) Kim S. Siow   JOURNAL OF ALLOYS AND COMPOUNDS

Die Attach Materials for High Temperature Applications: A Review

(2011) V R Manikam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE

Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films

(2008) C.S. Hsu et al.   JOURNAL OF ELECTRONIC MATERIALS